Inventor · disambiguated record
Tetsushi Wakabayashi
Also filed as: WAKABAYASHI TETSUSHI
13 granted patents·370 citations·filing 1982–2000
93Inventor score
Files withFUJITSU LTD13
Top patents by PatentIndex Score
13 records- 0187US6347037B2Semiconductor device and method of forming the sameFUJITSU LTD·Filed 1998·Granted Feb 12, 2002·99 cites·14 claims
- 0283US6184133B1Method of forming an assembly board with insulator filled through holesFUJITSU LTD·Filed 2000·Granted Feb 6, 2001·26 cites·7 claims
- 0382US4598307AIntegrated circuit device having package with bypass capacitorFUJITSU LTD·Filed 1983·Granted Jul 1, 1986·53 cites·13 claims
- 0474US4724472ASemiconductor deviceFUJITSU LTD·Filed 1987·Granted Feb 9, 1988·45 cites·12 claims
- 0572US4535384AHeat sink for a semiconductor deviceFUJITSU LTD·Filed 1984·Granted Aug 13, 1985·36 cites·13 claims
- 0667US4688077ASemiconductor device having radiatorFUJITSU LTD·Filed 1986·Granted Aug 18, 1987·35 cites·12 claims
- 0764US5729435ASemiconductor device and assembly board having through-holes filled with filling coreFUJITSU LTD·Filed 1997·Granted Mar 17, 1998·22 cites·6 claims
- 0856US5041899AIntegrated circuit device having an improved package structureFUJITSU LTD·Filed 1989·Granted Aug 20, 1991·26 cites·26 claims
- 0950US6088233ASemiconductor device and assembly board having through-holes filled with filling coreFUJITSU LTD·Filed 1998·Granted Jul 11, 2000·11 cites·11 claims
- 1049US5978222ASemiconductor device and assembly board having through-holes filled with filling coreFUJITSU LTD·Filed 1997·Granted Nov 2, 1999·11 cites·9 claims
- 1149USD276719SIntegrated circuit deviceFUJITSU LTD·Filed 1982·Granted Dec 11, 1984·4 cites·1 claims
- 1230US5763297AIntegrated circuit carrier having lead-socket array with various inner dimensionsFUJITSU LTD·Filed 1996·Granted Jun 9, 1998·1 cites·10 claims
- 1330US5668407AIntegrated circuit carrier having lead-socket array with various inner dimensionsFUJITSU LTD·Filed 1996·Granted Sep 16, 1997·1 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →