Inventor · disambiguated record
Tetsuro Washida
Also filed as: WASHIDA TETSURO
15 granted patents·445 citations·filing 1994–1999
94Inventor score
Files withMITSUBISHI ELECTRIC CORP15
Top patents by PatentIndex Score
15 records- 0183US5949135AModule mounted with semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Sep 7, 1999·76 cites·4 claims
- 0282US5671123AIC card with a discharge pattern and a ground pattern separated from each otherMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Sep 23, 1997·51 cites·20 claims
- 0379US6115260AMemory module with obstacle removing terminal structureMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Sep 5, 2000·40 cites·9 claims
- 0478US5886874AIC cardMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Mar 23, 1999·44 cites·9 claims
- 0576US5774339AIC card and method of making the sameMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Jun 30, 1998·41 cites·6 claims
- 0669US6144091ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Nov 7, 2000·29 cites·7 claims
- 0769US5585617ANon-contact IC card communicating at multiple frequenciesMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Dec 17, 1996·39 cites·4 claims
- 0864US5877548ATerminal configuration in semiconductor IC deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Mar 2, 1999·31 cites·11 claims
- 0964US5719746AIC cardMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Feb 17, 1998·30 cites·13 claims
- 1059US5889327ASemiconductor device with a package having a plurality of bump electrodes and module with a plurality of semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Mar 30, 1999·25 cites·10 claims
- 1152US5777275ABendable circuit board having improved resistance to bending strain and increased element mounting areaMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Jul 7, 1998·18 cites·17 claims
- 1241US5583748ASemiconductor module having multiple circuit boardsMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Dec 10, 1996·8 cites·1 claims
- 1341US5521433AIC card including a substrate having improved strength and heat radiation propertiesMITSUBISHI ELECTRIC CORP·Filed 1995·Granted May 28, 1996·10 cites·9 claims
- 1430US5521786ASemiconductor module and IC package used for the semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 1994·Granted May 28, 1996·2 cites·2 claims
- 1526US6239981B1Packaging substrateMITSUBISHI ELECTRIC CORP·Filed 1999·Granted May 29, 2001·1 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →