Inventor · disambiguated record

Techi Wong

Also filed as: WONG TECHI

43 granted patents·9 pending applications·81 citations·filing 2018–2025

97Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD52

Top patents by PatentIndex Score

52 records

0198US11527474B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·8 cites·20 claims
0298US11380666B2Fan-out package with cavity substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·5 cites·20 claims
0396US11075151B2Fan-out package with controllable standoffTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·12 cites·20 claims
0496US10790162B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·14 cites·20 claims
0596US10515827B2Method for forming chip package with recessed interposer substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·12 cites·20 claims
0695US11600575B2Method for forming chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 7, 2023·2 cites·20 claims
0794US11322447B2Dual-sided routing in 3D SiP structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·3 cites·20 claims
0894US11101214B2Package structure with dam structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 24, 2021·8 cites·20 claims
0990US11296065B2Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 5, 2022·2 cites·20 claims
1088US2025364425A1Package structure with adhesive element over semiconductor chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1187US10468339B2Heterogeneous fan-out structure and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 5, 2019·3 cites·20 claims
1287US2025038087A1Heterogeneous Fan-Out Structure and Method of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1386US2024347439A1Chip package having multiple chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1484US12237262B2Semiconductor package with improved interposer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
1584US12199084B2Fan-out package with cavity substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
1684US11362010B2Structure and formation method of chip package with fan-out featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 14, 2022·3 cites·20 claims
1784US2024379577A1Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1883US11322449B2Package with fan-out structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 3, 2022·3 cites·20 claims
1983US2025253253A1Dual-sided routing in 3d semiconductor system-in-package structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2082US12308313B2Semiconductor package with improved interposer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 20, 2025·0 cites·20 claims
2182US12308322B2Dual-sided routing in 3D semiconductor system-in-package structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 20, 2025·0 cites·20 claims
2282US12131984B2Heterogeneous fan-out structure and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
2382US12100666B2Method for forming chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·20 claims
2482US12046548B2Chip package with redistribution structure having multiple chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
2582US11062997B2Method for forming chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 13, 2021·2 cites·20 claims
2681US2025079428A1Semiconductor Devices and Methods of ManufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2779US12476198B2Package structure with adhesive element over semiconductor chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
2879US12300592B2Fan-out package with controllable standoffTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
2979US2024379646A1Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3079US2024363533A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3177US11855059B2Fan-out package with cavity substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
3277US11114311B2Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 7, 2021·2 cites·20 claims
3377US10985100B2Chip package with recessed interposer substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·1 cites·20 claims
3476US12176337B2Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 24, 2024·0 cites·20 claims
3576US11824007B2Dual-sided routing in 3D SiP structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
3675US11848265B2Semiconductor package with improved interposer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 19, 2023·0 cites·20 claims
3775US11646256B2Heterogeneous fan-out structure and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 9, 2023·0 cites·20 claims
3875US10804254B2Fan-out package with cavity substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 13, 2020·1 cites·20 claims
3974US11670577B2Chip package with redistribution structure having multiple chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
4073US11948892B2Formation method of chip package with fan-out featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
4172US12170274B2Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 17, 2024·0 cites·20 claims
4272US12094819B2Method for forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
4372US11854955B2Fan-out package with controllable standoffTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
4471US2023378078A1Package with fan-out structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
4569US11430776B2Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 30, 2022·0 cites·20 claims
4665US11018081B2Heterogeneous fan-out structure and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 25, 2021·0 cites·20 claims
4763US12074104B2Integrated circuit packages with ring-shaped substratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·20 claims
4862US11094625B2Semiconductor package with improved interposer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·0 cites·20 claims
4961US11600573B2Structure and formation method of chip package with conductive support elements to reduce warpageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 7, 2023·0 cites·20 claims
5061US11239173B2Structure and formation method of chip package with fan-out featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 1, 2022·0 cites·20 claims

Showing the top 50 of 52 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →