Inventor · disambiguated record
Teck Kai Wong
Also filed as: WONG TECK KAI
2 granted patents·1 pending application·0 citations·filing 2017–2024
28Inventor score
Files withISOLA USA CORP3
Top patents by PatentIndex Score
3 records- 0174US11891475B2SMA resin formulationISOLA USA CORP·Filed 2022·Granted Feb 6, 2024·0 cites·17 claims
- 0260US11365282B2SMA resin formulationISOLA USA CORP·Filed 2017·Granted Jun 21, 2022·0 cites·26 claims
- 0347US2025115751A1Thermosetting compositions, cured compositions, and prepregs and laminates based on sameISOLA USA CORP·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →