Inventor · disambiguated record
Teruaki Yuoka
Also filed as: YUOKA TERUAKI
8 granted patents·4 pending applications·6 citations·filing 2002–2019
75Inventor score
Files withKITAGAWA IND CO LTD12
Top patents by PatentIndex Score
12 records- 0164US7575800B2Sliding parts, precision parts and timepieces and electronic equipment using the sameKITAGAWA IND CO LTD·Filed 2002·Granted Aug 18, 2009·5 cites·6 claims
- 0263US9704638B2Output noise reducing deviceKITAGAWA IND CO LTD·Filed 2014·Granted Jul 11, 2017·1 cites·7 claims
- 0359US11958968B2Thermally conductive material technical fieldKITAGAWA IND CO LTD·Filed 2019·Granted Apr 16, 2024·0 cites·8 claims
- 0454US10352627B2Nucleation device, heat storage device, and nucleation method for heat storage materialKITAGAWA IND CO LTD·Filed 2017·Granted Jul 16, 2019·0 cites·15 claims
- 0550US10386122B2Nucleation device, heat storage device, and nucleation method for heat storage materialKITAGAWA IND CO LTD·Filed 2016·Granted Aug 20, 2019·0 cites·3 claims
- 0648US9587153B2Heat storage material composition and heat storage materialKITAGAWA IND CO LTD·Filed 2013·Granted Mar 7, 2017·0 cites·2 claims
- 0748US2009286064A1Sliding parts, precision parts and timepieces and electronic equipment using the sameKITAGAWA IND CO LTD·Filed 2009·Application pending·0 cites
- 0846US2011086976A1Sliding parts, precision parts and timepieces and electronic equipment using the sameKITAGAWA IND CO LTD·Filed 2010·Application pending·0 cites
- 0943US10851236B2Composition for thermally conductive material and thermally conductive materialKITAGAWA IND CO LTD·Filed 2018·Granted Dec 1, 2020·0 cites·12 claims
- 1042US9273205B2Vibration damping materialKITAGAWA IND CO LTD·Filed 2013·Granted Mar 1, 2016·0 cites·8 claims
- 1139US2018003446A1Method for manufacturing heat storage device, method for manufacturing heat storage material, heat storage material, and heat storage deviceKITAGAWA IND CO LTD·Filed 2017·Application pending·0 cites
- 1236US2022017804A1Composition for Low Dielectric Thermally Conductive Material and Low Dielectric Thermally Conductive MaterialKITAGAWA IND CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →