Inventor · disambiguated record

Thomas Blount

Also filed as: BLOUNT THOMAS B

2 granted patents·1 pending application·66 citations·filing 2002–2005

67Inventor score

Technology areasH10W

Files withKULICKE & SOFFA INVESTMENTS3

Top patents by PatentIndex Score

3 records

0191US6953999B2High density chip level package for the packaging of integrated circuits and method to manufacture sameKULICKE & SOFFA INVESTMENTS·Filed 2005·Granted Oct 11, 2005·35 cites·18 claims
0279US6872589B2High density chip level package for the packaging of integrated circuits and method to manufacture sameKULICKE & SOFFA INVESTMENTS·Filed 2003·Granted Mar 29, 2005·31 cites·15 claims
0332US2003197285A1High density substrate for the packaging of integrated circuitsKULICKE & SOFFA INVESTMENTS·Filed 2002·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →