Inventor · disambiguated record
Thomas Bodner
Also filed as: BODNER THOMAS
11 granted patents·1 pending application·7 citations·filing 2013–2020
80Inventor score
Files withAMS AG12
Top patents by PatentIndex Score
12 records- 0185US9852955B2Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor componentAMS AG·Filed 2016·Granted Dec 26, 2017·6 cites·21 claims
- 0262US9929035B2Method of producing a removable wafer connection and carrier for wafer supportAMS AG·Filed 2013·Granted Mar 27, 2018·1 cites·4 claims
- 0351US12362230B2Method of producing a semiconductor body with a trench, semiconductor body with at least one trench and semiconductor deviceAMS AG·Filed 2020·Granted Jul 15, 2025·0 cites·13 claims
- 0450US9991177B2Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor componentAMS AG·Filed 2017·Granted Jun 5, 2018·0 cites·3 claims
- 0546US12100644B2Semiconductor device with through-substrate via and method of manufacturing a semiconductor device with through-substrate viaAMS AG·Filed 2019·Granted Sep 24, 2024·0 cites·15 claims
- 0645US11139207B2Method for manufacturing a semiconductor device and semiconductor deviceAMS AG·Filed 2018·Granted Oct 5, 2021·0 cites·18 claims
- 0745US10847664B2Optical package and method of producing an optical packageAMS AG·Filed 2016·Granted Nov 24, 2020·0 cites·18 claims
- 0842US11271134B2Method for manufacturing an optical sensor and optical sensorAMS AG·Filed 2018·Granted Mar 8, 2022·0 cites·10 claims
- 0940US10943936B2Method of producing an optical sensor at wafer-level and optical sensorAMS AG·Filed 2017·Granted Mar 9, 2021·0 cites·11 claims
- 1038US11675049B2Method for fabricating a plurality of time-of-flight sensor devicesAMS AG·Filed 2018·Granted Jun 13, 2023·0 cites·12 claims
- 1136US2019237500A13d-integrated optical sensor and method of producing a 3d-integrated optical sensorAMS AG·Filed 2017·Application pending·0 cites
- 1234US10734534B2Method of producing an optical sensor at wafer-level and optical sensorAMS AG·Filed 2016·Granted Aug 4, 2020·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →