Inventor · disambiguated record
Thomas J. De Bonis
Also filed as: DE BONIS THOMAS · DE BONIS THOMAS J
8 granted patents·1 pending application·6 citations·filing 2014–2023
79Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0188US10700051B2Multi-chip packagingINTEL CORP·Filed 2018·Granted Jun 30, 2020·4 cites·24 claims
- 0283US12476235B2Multi-chip packagingINTEL CORP·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 0376US12199085B2Multi-chip packagingINTEL CORP·Filed 2022·Granted Jan 14, 2025·0 cites·23 claims
- 0475US11817444B2Multi-chip packagingINTEL CORP·Filed 2022·Granted Nov 14, 2023·0 cites·20 claims
- 0571US11348911B2Multi-chip packagingINTEL CORP·Filed 2020·Granted May 31, 2022·0 cites·20 claims
- 0662US9613933B2Package structure to enhance yield of TMI interconnectionsDE BONIS THOMAS J·Filed 2014·Granted Apr 4, 2017·2 cites·20 claims
- 0752US10049971B2Package structure to enhance yield of TMI interconnectionsINTEL CORP·Filed 2017·Granted Aug 14, 2018·0 cites·3 claims
- 0837US2019104610A1Substrate architecture for solder joint reliabilty in microelectronic package structures and methods of forming the sameINTEL CORP·Filed 2017·Application pending·0 cites
- 0935US11222877B2Thermally coupled package-on-package semiconductor packagesINTEL CORP·Filed 2017·Granted Jan 11, 2022·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →