Inventor · disambiguated record
Thomas Feil
Also filed as: FEIL THOMAS · FEIL THOMAS MARTIN
23 granted patents·8 pending applications·41 citations·filing 2017–2024
93Inventor score
Top patents by PatentIndex Score
31 records- 0194US10573742B1Oxygen inserted Si-layers in vertical trench power devicesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Feb 25, 2020·11 cites·24 claims
- 0291US10580888B1Oxygen inserted Si-layers for reduced contact implant outdiffusion in vertical power devicesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Mar 3, 2020·7 cites·22 claims
- 0390US10243051B2Transistor device with a field electrode that includes two layersINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Mar 26, 2019·5 cites·23 claims
- 0487US10720500B2Transistor device with a field electrode that includes two layersINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Jul 21, 2020·3 cites·24 claims
- 0586US10861966B2Vertical trench power devices with oxygen inserted Si-layersINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Dec 8, 2020·3 cites·20 claims
- 0683US11302579B2Composite wafer, semiconductor device and electronic componentINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 12, 2022·1 cites·5 claims
- 0783US10957771B2Transistor device with a field electrode that includes two layersINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Mar 23, 2021·1 cites·20 claims
- 0882US11158627B2Electronic circuit with a transistor device and a clamping circuitINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Oct 26, 2021·3 cites·21 claims
- 0979US11031478B2Semiconductor device having body contacts with dielectric spacers and corresponding methods of manufactureINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Jun 8, 2021·2 cites·28 claims
- 1079US10672664B2Composite wafer, semiconductor device, electronic component and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 2, 2020·2 cites·14 claims
- 1177US10236351B2Power semiconductor device trench having field plate and gate electrodeINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Mar 19, 2019·2 cites·12 claims
- 1275US2024194754A1Semiconductor device and corresponding methods of manufactureINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1374US11848237B2Composite wafer, semiconductor device and electronic componentINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 19, 2023·0 cites·10 claims
- 1474US2025107144A1Semiconductor device and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1573US11581409B2Transistor device with a field electrode that includes two layersINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Feb 14, 2023·0 cites·20 claims
- 1671US2025107143A1Semiconductor device having a vertical power transistor with a metal silicide gate regionINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1770US12087717B2Semiconductor package and methods of manufacturing a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Sep 10, 2024·0 cites·23 claims
- 1867US10529845B2Semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Jan 7, 2020·1 cites·20 claims
- 1965US2021273067A1Semiconductor device having body contact regions and corresponding methods of manufactureINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Application pending·0 cites
- 2062US10868172B2Vertical power devices with oxygen inserted Si-layersINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Dec 15, 2020·0 cites·23 claims
- 2159US11081457B2Semiconductor package and methods of manufacturing a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Aug 3, 2021·0 cites·26 claims
- 2259US10529811B2Power semiconductor device having a trench with control and field electrode structuresINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Jan 7, 2020·0 cites·20 claims
- 2358US12389658B2Semiconductor die with a transistor device and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Aug 12, 2025·0 cites·16 claims
- 2458US11069639B2Semiconductor module, electronic component and method of manufacturing a semiconductor moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Jul 20, 2021·0 cites·12 claims
- 2558US2024290877A1Semiconductor die and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 2657US12433013B2Semiconductor die with a vertical transistor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Sep 30, 2025·0 cites·21 claims
- 2757US2025096121A1Transistor device with reduced on-resistanceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 2853US2024243130A1Semiconductor Die with a Vertical Power Transistor DeviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Application pending·0 cites
- 2952US11417732B2Semiconductor transistor device and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Aug 16, 2022·0 cites·18 claims
- 3050US11908904B2Planar gate semiconductor device with oxygen-doped Si-layersINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Feb 20, 2024·0 cites·22 claims
- 3142US2020111896A1Transistor Device and Method for Forming a Recess for a Trench Gate ElectrodeINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →