Inventor · disambiguated record
Thomas Gorczyca
Also filed as: GORCZYCA THOMAS · GORCZYCA THOMAS BENT
1 granted patent·1 pending application·239 citations·filing 1995–2006
56Inventor score
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2 records- 0193US5866952AHigh density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrateLOCKHEED CORP·Filed 1995·Granted Feb 2, 1999·239 cites·11 claims
- 0242US2008116552A1Electronic System With Lead Free Interconnections And Method of FabricationROSE JAMES·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →