Inventor · disambiguated record
Thomas Jacob Hammann
Also filed as: HAMMANN THOMAS JACOB
2 granted patents·3 pending applications·0 citations·filing 2020–2025
27Inventor score
Technology areasH10W
Files withSAMTEC INC5
Top patents by PatentIndex Score
5 records- 0166US2025014983A1Electrically conductive vias and methods for producing sameSAMTEC INC·Filed 2024·Application pending·0 cites
- 0262US2025301576A1High aspect ratio vias filled with liquid metal fillSAMTEC INC·Filed 2025·Application pending·0 cites
- 0357US12100647B2Electrically conductive vias and methods for producing sameSAMTEC INC·Filed 2020·Granted Sep 24, 2024·0 cites·22 claims
- 0454US12336112B2High aspect ratio vias filled with liquid metal fillSAMTEC INC·Filed 2022·Granted Jun 17, 2025·0 cites·18 claims
- 0542US2025087569A1Filling materials and methods of filling viasSAMTEC INC·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Thomas Jacob Hammann files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →