Inventor · disambiguated record
Thomas Kilger
Also filed as: KILGER THOMAS
25 granted patents·3 pending applications·130 citations·filing 2003–2021
94Inventor score
Top patents by PatentIndex Score
28 records- 0198US9704843B2Integrated system and method of making the integrated systemINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jul 11, 2017·51 cites·4 claims
- 0294US8890284B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Nov 18, 2014·17 cites·20 claims
- 0391US8828807B1Method of packaging integrated circuits and a molded substrate with non-functional placeholders embedded in a molding compoundINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 9, 2014·11 cites·22 claims
- 0489US11195787B2Semiconductor device including an antennaINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 7, 2021·7 cites·12 claims
- 0589US9725303B1Semiconductor device including a MEMS die and a conductive layerINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 8, 2017·5 cites·17 claims
- 0688US10549985B2Semiconductor package with a through port for sensor applicationsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 4, 2020·4 cites·15 claims
- 0785US9099454B2Molded semiconductor package with backside die metallizationINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 4, 2015·8 cites·22 claims
- 0883US8552828B1System and method for a coreless transformerBEER GOTTFRIED·Filed 2012·Granted Oct 8, 2013·8 cites·34 claims
- 0982US7847387B2Electrical device and methodINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 7, 2010·9 cites·10 claims
- 1081US9981843B2Chip package and a method of producing the sameINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 29, 2018·2 cites·20 claims
- 1173US9147585B2Method for fabricating a plurality of semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 29, 2015·2 cites·9 claims
- 1270US9275878B2Metal redistribution layer for molded substratesINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 1, 2016·2 cites·10 claims
- 1368US9718678B2Package arrangement, a package, and a method of manufacturing a package arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Granted Aug 1, 2017·2 cites·17 claims
- 1466US9041505B2System and method for a coreless transformerINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 26, 2015·2 cites·27 claims
- 1563US2022148951A1Semiconductor device including an antennaINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 1656US10224317B2Integrated system and method of making the integrated systemINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 5, 2019·0 cites·14 claims
- 1756US9487392B2Method of packaging integrated circuits and a molded packageINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 8, 2016·0 cites·18 claims
- 1855US11823970B2Radar package with optical lens for radar wavesINFINEON TECHNOLOGIES AG·Filed 2021·Granted Nov 21, 2023·0 cites·26 claims
- 1950US11416730B2Radio-frequency device with radio-frequency signal carrying element and associated production methodINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 16, 2022·0 cites·23 claims
- 2050US10930541B2Method of forming a chip arrangement, chip arrangement, method of forming a chip package, and chip packageINFINEON TECHNOLOGIES AG·Filed 2019·Granted Feb 23, 2021·0 cites·32 claims
- 2148US9806056B2Method of packaging integrated circuitsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 31, 2017·0 cites·17 claims
- 2248US7354797B2Method for producing a plurality of electronic devicesINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 8, 2008·0 cites·6 claims
- 2346US9136213B2Integrated system and method of making the integrated systemKILGER THOMAS·Filed 2012·Granted Sep 15, 2015·0 cites·7 claims
- 2444US12368111B2Semiconductor apparatuses with radio-frequency line elements, and associated manufacturing methodsINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jul 22, 2025·0 cites·20 claims
- 2544US2008017985A1Electronic device with a plurality of substrates and method for manufacturing sameINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 2644US2016035677A1Method for forming a package arrangement and package arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
- 2741US7067915B2Electronic device with external contact elements and method for producing a plurality of the devicesINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jun 27, 2006·0 cites·8 claims
- 2838US10626012B2Semiconductor device including a cavity lidINFINEON TECHNOLOGIES AG·Filed 2015·Granted Apr 21, 2020·0 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →