Inventor · disambiguated record
Thomas S. Kobayashi
Also filed as: KOBAYASHI THOMAS S · KOBAYASHI THOMAS SACHIO
12 granted patents·433 citations·filing 1994–2013
93Inventor score
Top patents by PatentIndex Score
12 records- 0186US5461007AProcess for polishing and analyzing a layer over a patterned semiconductor substrateMOTOROLA INC·Filed 1994·Granted Oct 24, 1995·85 cites·30 claims
- 0285US6531384B1Method of forming a bond pad and structure thereofMOTOROLA INC·Filed 2001·Granted Mar 11, 2003·55 cites·20 claims
- 0385US6420208B1Method of forming an alternative ground contact for a semiconductor dieMOTOROLA INC·Filed 2000·Granted Jul 16, 2002·45 cites·20 claims
- 0483US6803302B2Method for forming a semiconductor device having a mechanically robust pad interfaceFREESCALE SEMICONDUCTOR INC·Filed 1999·Granted Oct 12, 2004·64 cites·16 claims
- 0575US9134944B1Systems, methods, and mediums for selecting a printing device in a networkINTELLECTUAL VENTURES FUND 79 LLC·Filed 2013·Granted Sep 15, 2015·7 cites·20 claims
- 0673US5707492AMetallized pad polishing processMOTOROLA INC·Filed 1995·Granted Jan 13, 1998·46 cites·8 claims
- 0772US7169694B2Method for forming a bond pad interfaceFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Jan 30, 2007·16 cites·33 claims
- 0868US5985045AProcess for polishing a semiconductor substrateMOTOROLA INC·Filed 1997·Granted Nov 16, 1999·35 cites·30 claims
- 0967US5374585AProcess for forming field isolationMOTOROLA INC·Filed 1994·Granted Dec 20, 1994·38 cites·17 claims
- 1063US5691253AProcess for polishing and analyzing an exposed surface of a patterned semiconductorMOTOROLA INC·Filed 1995·Granted Nov 25, 1997·24 cites·25 claims
- 1162US7535078B2Semiconductor device having a fuse and method of forming thereofFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted May 19, 2009·11 cites·20 claims
- 1256US6551922B1Method for making a semiconductor device by variable chemical mechanical polish downforceMOTOROLA INC·Filed 2002·Granted Apr 22, 2003·7 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →