Inventor · disambiguated record
Thiam Chye Lim
Also filed as: CHYE LIM THIAM · LIM THIAM C · LIM THIAM CHYE
20 granted patents·2 pending applications·348 citations·filing 2002–2019
96Inventor score
Files withMICRON TECHNOLOGY INC19NAT UNIV SINGAPORE1OSTEOPORE INT PTE LTD1OSTEOPORE INTERNAT PTE LTD1
Top patents by PatentIndex Score
22 records- 0197US7309623B2Method of fabricating a stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 18, 2007·45 cites·23 claims
- 0294US9673183B2Methods of making semiconductor device packages and related semiconductor device packagesMICRON TECHNOLOGY INC·Filed 2015·Granted Jun 6, 2017·11 cites·26 claims
- 0393US7282390B2Stacked die-in-die BGA package with die having a recessMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 16, 2007·19 cites·20 claims
- 0493US7259451B2Invertible microfeature device packagesMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 21, 2007·28 cites·17 claims
- 0593US6720666B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 13, 2004·91 cites·53 claims
- 0688US6692987B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 17, 2004·60 cites·74 claims
- 0787US7282392B2Method of fabricating a stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 16, 2007·8 cites·21 claims
- 0886US7799610B2Method of fabricating a stacked die having a recess in a die BGA packageMICRON TECHNOLOGY INC·Filed 2007·Granted Sep 21, 2010·7 cites·25 claims
- 0984US8373277B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2008·Granted Feb 12, 2013·6 cites·7 claims
- 1082US7358117B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 15, 2008·5 cites·36 claims
- 1181US7332820B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 19, 2008·16 cites·84 claims
- 1280US7332819B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 19, 2008·16 cites·67 claims
- 1379US7575953B2Stacked die with a recess in a die BGA packageMICRON TECHNOLOGY INC·Filed 2007·Granted Aug 18, 2009·4 cites·22 claims
- 1478US7344969B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 18, 2008·13 cites·70 claims
- 1577US10115715B2Methods of making semiconductor device packages and related semiconductor device packagesMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 30, 2018·2 cites·20 claims
- 1676US7371608B2Method of fabricating a stacked die having a recess in a die BGA packageMICRON TECHNOLOGY INC·Filed 2003·Granted May 13, 2008·12 cites·42 claims
- 1760US10937250B2Methods of reconstructing skullsNAT UNIV SINGAPORE·Filed 2017·Granted Mar 2, 2021·1 cites·20 claims
- 1858US2013154117A1Stacked die in die bga packageMICRON TECHNOLOGY INC·Filed 2013·Application pending·0 cites
- 1954US11282746B2Method of manufacturing microelectronic devices, related tools and apparatusMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 22, 2022·0 cites·24 claims
- 2050US7112048B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 26, 2006·4 cites·33 claims
- 2149US2007083268A1Bioabsorbable plug implants and method for bone tissue regenerationOSTEOPORE INTERNAT PTE LTD·Filed 2004·Application pending·0 cites
- 2241US9492279B2Bioabsorbable plug implants and method for bone tissue regenerationOSTEOPORE INT PTE LTD·Filed 2014·Granted Nov 15, 2016·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →