Inventor · disambiguated record
Thomas Mclenithan
Also filed as: MCLENITHAN THOMAS · MCLENITHAN THOMAS W
8 granted patents·8 pending applications·145 citations·filing 2014–2025
88Inventor score
Technology areasB65B
Files withNEW SPS POD LLC5MULTI-PACK SOLUTIONS LLC3Soluble Packaging Solutions2HENKEL AG & CO KGAA1MULTI PACK CHICAGO LLC1
Top patents by PatentIndex Score
16 records- 0192USD774249SDetergent pouchMULTI-PACK SOLUTIONS LLC·Filed 2015·Granted Dec 13, 2016·61 cites·1 claims
- 0288US10273027B2Systems and methods for forming dual layer water soluble packetsMULTI PAK SOLUTIONS LLC·Filed 2015·Granted Apr 30, 2019·10 cites·21 claims
- 0387USD774250SDetergent pouchMULTI-PACK SOLUTIONS LLC·Filed 2015·Granted Dec 13, 2016·35 cites·1 claims
- 0481USD996712SDetergent pouchNEW USN CHICAGO LLC·Filed 2020·Granted Aug 22, 2023·11 cites·1 claims
- 0578US2025051047A1Systems and methods for forming openings in water soluble packetNEW SPS POD LLC·Filed 2024·Application pending·0 cites
- 0677US2024317441A1Systems and methods for forming dual layer water soluble packetsNEW SPS POD LLC·Filed 2024·Application pending·0 cites
- 0776USD774251SDetergent pouchMULTI-PACK SOLUTIONS LLC·Filed 2015·Granted Dec 13, 2016·19 cites·1 claims
- 0876US2025223067A1Systems and methods for forming dual layer water soluble packetsNEW SPS POD LLC·Filed 2025·Application pending·0 cites
- 0974US2024025582A1Systems and methods for forming openings in water soluble packetNEW SPS POD LLC·Filed 2023·Application pending·0 cites
- 1072USD1022316SPouchHENKEL AG & CO KGAA·Filed 2021·Granted Apr 9, 2024·4 cites·1 claims
- 1171US11077974B2Systems and methods for forming dual layer water soluble packetsMULTI PACK CHICAGO LLC·Filed 2019·Granted Aug 3, 2021·1 cites·21 claims
- 1270US2023138404A1Systems and methods for forming openings in water soluble packetSoluble Packaging Solutions·Filed 2022·Application pending·0 cites
- 1368USD1017128SDetergent pouchNEW SPS POD LLC·Filed 2021·Granted Mar 5, 2024·4 cites·1 claims
- 1466US2021331822A1Systems and methods for forming dual layer water soluble packetsRADIENZ LIVING CHICAGO LLC·Filed 2021·Application pending·0 cites
- 1563US2021276742A1Systems and methods for forming openings in water soluble packetsSoluble Packaging Solutions·Filed 2021·Application pending·0 cites
- 1653US2014228194A1Systems and methods for forming openings in water soluble packetsMULTI PACK SOLUTIONS·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →