Inventor · disambiguated record
Thomas Neyer
Also filed as: NEYER THOMAS
17 granted patents·3 pending applications·36 citations·filing 2005–2023
90Inventor score
Top patents by PatentIndex Score
20 records- 0197US10388526B1Semiconductor wafer thinning systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Aug 20, 2019·18 cites·20 claims
- 0295US11373859B2Semiconductor substrate singulation systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jun 28, 2022·4 cites·14 claims
- 0392US11481532B2Systems and methods for designing a discrete device productSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 25, 2022·5 cites·16 claims
- 0487US10896815B2Semiconductor substrate singulation systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Jan 19, 2021·4 cites·18 claims
- 0586US11880642B2Systems and methods for designing a discrete device productSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Jan 23, 2024·1 cites·20 claims
- 0685US10665458B2Semiconductor wafer thinning systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted May 26, 2020·1 cites·20 claims
- 0777US2024119206A1Systems and methods for designing a discrete device productSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 0876US12501649B2Power device with graded channelSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Dec 16, 2025·0 cites·20 claims
- 0973US10950596B2Diode with current sensorSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Mar 16, 2021·2 cites·20 claims
- 1070US11152211B2Semiconductor wafer thinning systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 19, 2021·0 cites·16 claims
- 1168US11398437B2Power device including metal layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jul 26, 2022·1 cites·20 claims
- 1264US12125884B2MOSFET device with undulating channelSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Oct 22, 2024·0 cites·19 claims
- 1364US2022359426A1Power device including metal layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Application pending·0 cites
- 1461US11605732B2Power device with graded channelSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Mar 14, 2023·0 cites·18 claims
- 1555US11658214B2MOSFET device with undulating channelSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted May 23, 2023·0 cites·16 claims
- 1648US11652027B2Vertical transistors with gate connection gridSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 1747US11817478B2Termination structures with reduced dynamic output capacitance lossSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Nov 14, 2023·0 cites·20 claims
- 1845US10629686B2Carbon-controlled ohmic contact layer for backside ohmic contact on a silicon carbide power semiconductor deviceSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Apr 21, 2020·0 cites·20 claims
- 1934US7191085B2Method for testing an electric circuitINFINEON TECHNOLOGIES AG·Filed 2005·Granted Mar 13, 2007·0 cites·20 claims
- 2033US2005270865A1Test apparatus with memory data converter for redundant bit and word linesINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Thomas Neyer files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →