Inventor · disambiguated record
Thomas R. Pian
Also filed as: PIAN THOMAS R
6 granted patents·264 citations·filing 1992–1994
86Inventor score
Technology areasH10W
Files withEASTMAN KODAK CO6
Top patents by PatentIndex Score
6 records- 0190US5246880AMethod for creating substrate electrodes for flip chip and other applicationsEASTMAN KODAK CO·Filed 1992·Granted Sep 21, 1993·132 cites·7 claims
- 0268US5213676AMethod of generating a substrate electrode for flip chip and other applicationsEASTMAN KODAK CO·Filed 1992·Granted May 25, 1993·41 cites·12 claims
- 0366US5169056AConnecting of semiconductor chips to circuit substratesEASTMAN KODAK CO·Filed 1992·Granted Dec 8, 1992·38 cites·5 claims
- 0462US5235140AElectrode bump for flip chip die attachmentEASTMAN KODAK CO·Filed 1992·Granted Aug 10, 1993·32 cites·11 claims
- 0541US5212406AHigh density packaging of solid state devicesEASTMAN KODAK CO·Filed 1992·Granted May 18, 1993·12 cites·11 claims
- 0637US5400219ATape automated bonding for electrically connecting semiconductor chips to substratesEASTMAN KODAK CO·Filed 1994·Granted Mar 21, 1995·9 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →