Inventor · disambiguated record
Thomas Rohleder
Also filed as: ROHLEDER THOMAS
6 granted patents·1 pending application·36 citations·filing 2012–2015
79Inventor score
Files withNXP BV7
Top patents by PatentIndex Score
7 records- 0193US9847258B2Plasma dicing with blade saw patterned underside maskNXP BV·Filed 2015·Granted Dec 19, 2017·16 cites·14 claims
- 0286US8809166B2High die strength semiconductor wafer processing method and systemNXP BV·Filed 2012·Granted Aug 19, 2014·9 cites·9 claims
- 0384US9601437B2Plasma etching and stealth dicing laser processNXP BV·Filed 2014·Granted Mar 21, 2017·7 cites·19 claims
- 0469US8895363B2Die preparation for wafer-level chip scale package (WLCSP)NXP BV·Filed 2013·Granted Nov 25, 2014·3 cites·6 claims
- 0562US9812361B2Combination grinding after laser (GAL) and laser on-off function to increase die strengthNXP BV·Filed 2014·Granted Nov 7, 2017·1 cites·15 claims
- 0644US9349645B2Apparatus, device and method for wafer dicingNXP BV·Filed 2013·Granted May 24, 2016·0 cites·13 claims
- 0743US2016172243A1Wafer material removalNXP BV·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →