Inventor · disambiguated record
Thomas Schiwon
Also filed as: SCHIWON THOMAS
4 granted patents·3 citations·filing 2015–2024
61Inventor score
Top patents by PatentIndex Score
4 records- 0182US10501860B2Method and apparatus for electroplating a metal onto a substrateATOTECH DEUTSCHLAND GMBH·Filed 2015·Granted Dec 10, 2019·2 cites·17 claims
- 0276US12439528B2Method of preparing a high density interconnect printed circuit board including microvias filled with copperATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2024·Granted Oct 7, 2025·0 cites·13 claims
- 0366US11015257B2Method and apparatus for electroplating a metal onto a substrateATOTECH DEUTSCHLAND GMBH·Filed 2019·Granted May 25, 2021·1 cites·19 claims
- 0459US12245383B2Method of preparing a high density interconnect printed circuit board including microvias filled with copperATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2020·Granted Mar 4, 2025·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →