Inventor · disambiguated record
Theresa Ann Sitnik-Nieters
Also filed as: SITNIK-NIETERS THERESA A · SITNIK-NIETERS THERESA ANN
13 granted patents·1,377 citations·filing 1993–2001
95Inventor score
Top patents by PatentIndex Score
13 records- 0199US5745984AMethod for making an electronic moduleMARTIN MARIETTA CORP·Filed 1995·Granted May 5, 1998·559 cites·8 claims
- 0297US5434751AReworkable high density interconnect structure incorporating a release layerMARTIN MARIETTA CORP·Filed 1994·Granted Jul 18, 1995·247 cites·17 claims
- 0393US6294741B1Electronics module having high density interconnect structures incorporating an improved dielectric lamination adhesiveLOCKHEED CORP·Filed 1997·Granted Sep 25, 2001·131 cites·6 claims
- 0488US5785787AProcessing low dielectric constant materials for high speed electronicsGEN ELECTRIC·Filed 1995·Granted Jul 28, 1998·52 cites·6 claims
- 0588US5576517ALow Dielectric constant materials for high speed electronicsGEN ELECTRIC·Filed 1995·Granted Nov 19, 1996·80 cites·6 claims
- 0688US5449427AProcessing low dielectric constant materials for high speed electronicsGEN ELECTRIC·Filed 1994·Granted Sep 12, 1995·76 cites·14 claims
- 0785US5548099AMethod for making an electronics module having air bridge protection without large area ablationMARTIN MARIETTA CORP·Filed 1994·Granted Aug 20, 1996·81 cites·11 claims
- 0879US6770885B2Systems and methods for detecting ionizing radiation with an imaging systemGEN ELECTRIC·Filed 2001·Granted Aug 3, 2004·21 cites·17 claims
- 0978US6362722B1Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive compositeGEN ELECTRIC·Filed 2000·Granted Mar 26, 2002·10 cites·12 claims
- 1078US6297459B1Processing low dielectric constant materials for high speed electronicsGEN ELECTRIC·Filed 1998·Granted Oct 2, 2001·31 cites·8 claims
- 1174US5554305AProcessing low dielectric constant materials for high speed electronicsGEN ELECTRIC·Filed 1995·Granted Sep 10, 1996·35 cites·5 claims
- 1271US5401687AProcess for high density interconnection of substrates and integrated circuit chips containing sensitive structuresMARTIN MARIETTA CORP·Filed 1993·Granted Mar 28, 1995·43 cites·30 claims
- 1350US6191681B1Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive compositeGEN ELECTRIC·Filed 1997·Granted Feb 20, 2001·11 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →