Inventor · disambiguated record
Thomas L. Sounart
Also filed as: SOUNART THOMAS · SOUNART THOMAS L · SOUNART THOMAS LEE
32 granted patents·49 pending applications·18 citations·filing 2016–2024
93Inventor score
Top patents by PatentIndex Score
81 records- 0194US9902152B2Piezoelectric package-integrated synthetic jet devicesINTEL CORP·Filed 2016·Granted Feb 27, 2018·5 cites·20 claims
- 0280US12494443B2Substrate integrated thin film capacitors using amorphous high-k dielectricsINTEL CORP·Filed 2023·Granted Dec 9, 2025·0 cites·26 claims
- 0380US10594029B2Actuatable and adaptable metamaterials integrated in packageINTEL CORP·Filed 2016·Granted Mar 17, 2020·3 cites·22 claims
- 0479US11223524B2Package integrated security featuresINTEL CORP·Filed 2018·Granted Jan 11, 2022·2 cites·12 claims
- 0577US11804455B1Substrate integrated thin film capacitors using amorphous high-k dielectricsINTEL CORP·Filed 2022·Granted Oct 31, 2023·0 cites·25 claims
- 0676US11302618B2Microelectronic assemblies having substrate-integrated perovskite layersINTEL CORP·Filed 2018·Granted Apr 12, 2022·2 cites·20 claims
- 0776US11016288B2Adaptable displays using piezoelectric actuatorsINTEL CORP·Filed 2016·Granted May 25, 2021·2 cites·25 claims
- 0872US11908687B2III-N multichip modules and methods of fabricationINTEL CORP·Filed 2021·Granted Feb 20, 2024·0 cites·17 claims
- 0972US11756948B2In situ package integrated thin film capacitors for power deliveryINTEL CORP·Filed 2019·Granted Sep 12, 2023·1 cites·28 claims
- 1072US10921349B2Piezoelectric package-integrated current sensing devicesINTEL CORP·Filed 2016·Granted Feb 16, 2021·1 cites·22 claims
- 1172US10634566B2Piezoelectric package-integrated temperature sensing devicesINTEL CORP·Filed 2016·Granted Apr 28, 2020·1 cites·22 claims
- 1269US10251272B2Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substratesINTEL CORP·Filed 2017·Granted Apr 2, 2019·1 cites·21 claims
- 1367US2025108459A1Protective debonding stack for selective transferINTEL CORP·Filed 2023·Application pending·0 cites
- 1465US11421376B2Inorganic piezoelectric materials formed on fibers and applications thereofINTEL CORP·Filed 2016·Granted Aug 23, 2022·0 cites·10 claims
- 1565US11211245B2III-N multichip modules and methods of fabricationINTEL CORP·Filed 2020·Granted Dec 28, 2021·0 cites·20 claims
- 1661US2021375719A1Stacked die architectures with improved thermal managementINTEL CORP·Filed 2021·Application pending·0 cites
- 1759US12349282B2Capacitors in through glass viasINTEL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·23 claims
- 1859US11495552B2Substrate integrated thin film capacitors using amorphous high-k dielectricsINTEL CORP·Filed 2018·Granted Nov 8, 2022·0 cites·25 claims
- 1959US10644616B2Piezoelectric package-integrated motorINTEL CORP·Filed 2016·Granted May 5, 2020·0 cites·25 claims
- 2059US2025112187A1Ic assemblies with self-alignment structures having zero misalignmentINTEL CORP·Filed 2023·Application pending·0 cites
- 2159US2025210392A1Handling assembly, handling system and methodINTEL CORP·Filed 2023·Application pending·0 cites
- 2259US2025112186A1Tilt mitigation in self-alignment assisted assembly of ic dieINTEL CORP·Filed 2023·Application pending·0 cites
- 2359US2025218847A1Configurable carrier for transfer and self-assembly of multiple integrated circuit devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 2458US2025112200A1Hybrid bonding of thin die structures by self-alignment assisted assemblyINTEL CORP·Filed 2023·Application pending·0 cites
- 2558US2025112199A1Self-alignment assisted assembly of multi-level die complexesINTEL CORP·Filed 2023·Application pending·0 cites
- 2658US2025112181A1Bonding structures having non-vertical edges for self-alignment assisted assembly of integrated circuit die stacksINTEL CORP·Filed 2023·Application pending·0 cites
- 2758US2025112173A1Pre-assembly warpage compensation of thin die structuresINTEL CORP·Filed 2023·Application pending·0 cites
- 2858US2025112177A1Self-alignment assisted assembly on a structural wafer for hybrid bonded die stacksINTEL CORP·Filed 2023·Application pending·0 cites
- 2958US2025112127A1Ic assemblies with metal passivation at bond interfacesINTEL CORP·Filed 2023·Application pending·0 cites
- 3057US2025273478A1Infrared laser debond process for fusion-bonded or hybrid-bonded die complexes on reusable carrier wafersINTEL CORP·Filed 2024·Application pending·0 cites
- 3157US2025105053A1Selective transfer of optical and opto-electronic componentsINTEL CORP·Filed 2023·Application pending·0 cites
- 3257US2025112155A1Conformal coatings with spatially defined surface energies for die-to-wafer self-alignment assisted assemblyINTEL CORP·Filed 2023·Application pending·0 cites
- 3357US2025273557A1Laser debond process for fabrication of high-density organic interposersINTEL CORP·Filed 2024·Application pending·0 cites
- 3456US2025112210A1Fine-grain integration of group iii-v devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 3556US2025105136A1Capacitors for use with integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 3656US2025192096A1Self-assembly method and equipmentINTEL CORP·Filed 2023·Application pending·0 cites
- 3756US2025112077A1Architectures for facilitating bonding in wafer-level selective transfersINTEL CORP·Filed 2023·Application pending·0 cites
- 3856US2025112208A1Selective layer transfer with glass panelsINTEL CORP·Filed 2023·Application pending·0 cites
- 3956US2025112196A1Selective transfer of thermal management diesINTEL CORP·Filed 2023·Application pending·0 cites
- 4056US2025112218A1Selective layer transfer process improvementsINTEL CORP·Filed 2023·Application pending·0 cites
- 4156US2025105046A1Selective layer transferINTEL CORP·Filed 2023·Application pending·0 cites
- 4256US2025006671A1Semiconductor layer with dry deposition layerINTEL CORP·Filed 2023·Application pending·0 cites
- 4355US12489032B2Cooling of conformal power delivery structuresINTEL CORP·Filed 2021·Granted Dec 2, 2025·0 cites·9 claims
- 4455US12255225B2Low leakage thin film capacitors using titanium oxide dielectric with conducting noble metal oxide electrodesINTEL CORP·Filed 2020·Granted Mar 18, 2025·0 cites·20 claims
- 4555US10386204B2Integrated sensor and homologous calibration structure for resonant devicesINTEL CORP·Filed 2017·Granted Aug 20, 2019·0 cites·17 claims
- 4655US10116504B2Package integrated security featuresINTEL CORP·Filed 2016·Granted Oct 30, 2018·0 cites·13 claims
- 4755US2025112185A1Superhydrophobic surfaces for liquid containment in self-alignment assisted assembly of integrated circuit die stacksINTEL CORP·Filed 2023·Application pending·0 cites
- 4855US2025112188A1Fine-grain integration of radio frequency antennas, interconnects, and passivesINTEL CORP·Filed 2023·Application pending·0 cites
- 4955US2025112067A1Removal of defective dies on donor wafers for selective layer transferINTEL CORP·Filed 2023·Application pending·0 cites
- 5054US10658566B2Piezoelectric driven switches integrated in organic, flexible displaysINTEL CORP·Filed 2016·Granted May 19, 2020·0 cites·25 claims
Showing the top 50 of 81 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →