Inventor · disambiguated record
Thomas Spann
Also filed as: SPANN THOMAS
15 granted patents·6 pending applications·94 citations·filing 2010–2024
91Inventor score
Top patents by PatentIndex Score
21 records- 0192US8455987B1Electrically isolated power semiconductor package with optimized layoutSPANN THOMAS·Filed 2010·Granted Jun 4, 2013·49 cites·14 claims
- 0291US9443792B1Bridging DMB structure for wire bonding in a power semiconductor device moduleIXYS CORP·Filed 2015·Granted Sep 13, 2016·17 cites·20 claims
- 0385US10347549B2Power semiconductor device module having mechanical corner press-fit anchorsIXYS LLC·Filed 2016·Granted Jul 9, 2019·6 cites·20 claims
- 0483US9929066B1Power semiconductor device module baseplate having peripheral heelsIXYS CORP·Filed 2016·Granted Mar 27, 2018·5 cites·16 claims
- 0582US10000423B1Direct metal bonding on carbon-covered ceramic contact projections of a ceramic carrierIXYS CORP·Filed 2016·Granted Jun 19, 2018·2 cites·22 claims
- 0679US9640461B1Bridging DMB structure for wire bonding in a power semiconductor moduleIXYS CORP·Filed 2016·Granted May 2, 2017·4 cites·20 claims
- 0776US10062621B2Power semiconductor device module having mechanical corner press-fit anchorsIXYS CORP·Filed 2016·Granted Aug 28, 2018·3 cites·20 claims
- 0873US10276472B2Heat transfer plate having small cavities for taking up a thermal transfer materialIXYS LLC·Filed 2017·Granted Apr 30, 2019·2 cites·6 claims
- 0970US9941256B1Inverse diode stackIXYS CORP·Filed 2016·Granted Apr 10, 2018·2 cites·15 claims
- 1069US8901723B2Electrically isolated power semiconductor package with optimized layoutIXYS CORP·Filed 2013·Granted Dec 2, 2014·2 cites·19 claims
- 1163US8876996B2Method for the manufacture of double-sided metalized ceramic substratesWEIDENAUER WERNER·Filed 2011·Granted Nov 4, 2014·2 cites·23 claims
- 1258US2025218971A1Press pack power semiconductor device with locator stripLITTELFUSE INC·Filed 2023·Application pending·0 cites
- 1356US11798868B2Metal tab for chip assemblyLITTELFUSE INC·Filed 2021·Granted Oct 24, 2023·0 cites·20 claims
- 1454US9177888B2Electrically isolated power semiconductor package with optimized layoutIXYS CORP·Filed 2014·Granted Nov 3, 2015·0 cites·20 claims
- 1553US10446462B2Heat transfer plate having small cavities for taking up a thermal transfer materialLITTELFUSE INC·Filed 2019·Granted Oct 15, 2019·0 cites·6 claims
- 1652US2024014090A1High reliability semiconductor package designLITTELFUSE INC·Filed 2022·Application pending·0 cites
- 1750US2025253283A1Metal connector in semiconductor device packageLITTELFUSE INC·Filed 2024·Application pending·0 cites
- 1847US11811180B2Electrical contact for semiconductor packageIXYS SEMICONDUCTOR GMBH·Filed 2021·Granted Nov 7, 2023·0 cites·18 claims
- 1947US2021272874A1Power module housing with improved protrusion designLITTELFUSE INC·Filed 2021·Application pending·0 cites
- 2041US2019304857A1Power Semiconductor Device Module Having Mechanical Corner Press-Fit AnchorsLITTELFUSE INC·Filed 2019·Application pending·0 cites
- 2138US2022310409A1Method to connect power terminal to substrate within semiconductor packageLITTELFUSE INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →