Inventor · disambiguated record

Thomas L. Viau

Also filed as: VIAU THOMAS L

2 granted patents·93 citations·filing 1991–1991

67Inventor score

Technology areasH10W

Files withIBM2

Top patents by PatentIndex Score

2 records

0178US5059553AMetal bump for a thermal compression bond and method for making sameIBM·Filed 1991·Granted Oct 22, 1991·70 cites·5 claims
0251US5053851AMetal bump for a thermal compression bond and method for making sameIBM·Filed 1991·Granted Oct 1, 1991·23 cites·8 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →