Inventor · disambiguated record
Thomas Workman
Also filed as: WORKMAN THOMAS · WORKMAN THOMAS KEITH
12 granted patents·26 pending applications·126 citations·filing 2000–2025
90Inventor score
Files withADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC29ADEIA SEMICONDUCTOR TECH LLC2INTEL CORP2ORACLE INT CORP2EASTMAN CHEM CO1
Top patents by PatentIndex Score
38 records- 0198US11955463B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Apr 9, 2024·6 cites·55 claims
- 0298US11296053B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsINVENSAS BONDING TECH INC·Filed 2020·Granted Apr 5, 2022·41 cites·18 claims
- 0397US12272677B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted Apr 8, 2025·3 cites·21 claims
- 0491US9387505B2Methods, materials and apparatus for improving control and efficiency of layer-by-layer processesEASTMAN CHEM CO·Filed 2013·Granted Jul 12, 2016·9 cites·15 claims
- 0590US12191233B2Embedded cooling systems and methods of manufacturing embedded cooling systemsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Jan 7, 2025·1 cites·30 claims
- 0687US6724078B1Electronic assembly comprising solderable thermal interfaceINTEL CORP·Filed 2000·Granted Apr 20, 2004·46 cites·52 claims
- 0783US9501801B2One click to update buyer in mass on purchaser orders and prepare changes to communicate to supplierORACLE INT CORP·Filed 2013·Granted Nov 22, 2016·9 cites·20 claims
- 0881US2025266401A1Direct bonded stack structures for increased reliability and improved yield in microelectronicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 0980US12368087B2Embedded cooling systems for advanced device packaging and methods of manufacturing the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 1079US12341083B2Electronic device cooling structures bonded to semiconductor elementsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Jun 24, 2025·0 cites·12 claims
- 1176US2025226290A1Embedded cooling systems and methods of manufacturing embedded cooling systemsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1275US2024387439A1Direct gang bonding methods and structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1374US2025293120A1Electronic device cooling structures bonded to semiconductor elementsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 1467US2025221128A1Display devices using reconstituted substrates and methods of forming the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1565US7091063B2Electronic assembly comprising solderable thermal interface and methods of manufactureINTEL CORP·Filed 2004·Granted Aug 15, 2006·11 cites·25 claims
- 1664US2025391794A1Composite hybrid structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1763US2025054837A1Electronic device cooling structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1862US2025212554A1Transfer of multiple small elements to a carrierADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1961US12080672B2Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesiveADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Sep 3, 2024·0 cites·28 claims
- 2061US2025253206A1Integrated cooling assemblies for advanced device packaging and methods of manufacturing the sameADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 2159US2025006689A1Structures and methods for bonding diesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
- 2259US2025309044A1Thermal improvement systems for electronic devices and methods of forming the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 2357US2024105674A1Bonded structure and method of forming sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
- 2457US2025006520A1Apparatus for separating singulated die from substrate dicing tape and methods of using the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
- 2557US2024055407A1Bonded debugging elements for integrated circuits and methods for debugging integrated circuits using sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
- 2657US2023361074A1Low temperature direct bondingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
- 2756US2024222319A1Debonding repair devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
- 2856US2023268300A1Bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
- 2955US2024334733A1Tandem oled devices with stable inorganic charge generation layersADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Application pending·0 cites
- 3055US2023207514A1Apparatuses and methods for die bond controlADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Application pending·0 cites
- 3155US2023299029A1Expansion control for bondingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
- 3255US2025079364A1Methods and structures employing metal oxide for direct metal bondingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
- 3355US2024096683A1Apparatus for processing of singulated dies and methods for using the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
- 3455US2023207474A1Bonded structures with interconnect assembliesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Application pending·0 cites
- 3554US2024079376A1Rapid thermal processing for direct bondingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
- 3651US2023115122A1Method of bonding thin substratesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Application pending·0 cites
- 3750US10417649B2Business process global searchingORACLE INT CORP·Filed 2013·Granted Sep 17, 2019·0 cites·15 claims
- 3850US2025146754A1Rotary pyrolysis reactor and method of useOmega Holdings LLC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →