Inventor · disambiguated record
Timothy J. Allen
Also filed as: ALLEN JR TIMOTHY JAMES · ALLEN TIMOTHY J
32 granted patents·5 pending applications·692 citations·filing 1988–2018
98Inventor score
Files withMICRON TECHNOLOGY INC24COOPER CAMERON CORP6BALLARD POWER SYSTEMS3APPLE INC1KINSMAN LARRY D1
Top patents by PatentIndex Score
37 records- 0191US6785511B1Wireless vehicular repeater systemTYCO ELECTRONICS CORP·Filed 2000·Granted Aug 31, 2004·82 cites·4 claims
- 0289US6478087B2Apparatus and method for sensing the profile and position of a well component in a well boreCOOPER CAMERON CORP·Filed 2001·Granted Nov 12, 2002·93 cites·22 claims
- 0387US6516861B2Method and apparatus for injecting a fluid into a wellCOOPER CAMERON CORP·Filed 2000·Granted Feb 11, 2003·83 cites·20 claims
- 0486US6252772B1Removable heat sink bumpers on a quad flat packageMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 26, 2001·70 cites·26 claims
- 0584US7098569B2Rotor assembly for a permanent magnet power electric machineBALLARD POWER SYSTEMS·Filed 2004·Granted Aug 29, 2006·31 cites·17 claims
- 0675US6494267B2Wellhead assembly for accessing an annulus in a well and a method for its useCOOPER CAMERON CORP·Filed 2000·Granted Dec 17, 2002·45 cites·19 claims
- 0773US6484807B2Wellhead assembly for injecting a fluid into a well and method of using the sameCOOPER CAMERON CORP·Filed 2000·Granted Nov 26, 2002·43 cites·21 claims
- 0871US4949161AInterdigitized leadframe stripMICRON TECHNOLOGY INC·Filed 1988·Granted Aug 14, 1990·36 cites·4 claims
- 0967US6396131B1Stress reduction feature for LOC lead frameMICRON TECHNOLOGY INC·Filed 1997·Granted May 28, 2002·22 cites·17 claims
- 1066US6635954B2Stress reduction feature for LOC lead frameMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 21, 2003·8 cites·17 claims
- 1164US6907961B2Apparatus and method for retarding translation between two bodiesCOOPER CAMERON CORP·Filed 2002·Granted Jun 21, 2005·7 cites·5 claims
- 1263US6545343B2Hybrid frame with lead-lock tapeMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 8, 2003·6 cites·53 claims
- 1363US5021864ADie-mounting paddle for mechanical stress reduction in plastic IC packagesMICRON TECHNOLOGY INC·Filed 1990·Granted Jun 4, 1991·33 cites·10 claims
- 1462US4910866AMethod of manufacturing a series of leadframe strip carriers having fixed external dimensions and varied internal dimensions using a common moldMICRON TECHNOLOGY INC·Filed 1989·Granted Mar 27, 1990·27 cites·8 claims
- 1560US6569727B1Method of making a single-deposition-layer-metal dynamic random access memoryMICRON TECHNOLOGY INC·Filed 1997·Granted May 27, 2003·18 cites·39 claims
- 1656US6277225B1Stress reduction feature for LOC lead frameMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 21, 2001·14 cites·16 claims
- 1756US5717246AHybrid frame with lead-lock tapeMICRON TECHNOLOGY INC·Filed 1996·Granted Feb 10, 1998·12 cites·32 claims
- 1853US6610162B1Methods for stress reduction feature for LOC lead frameMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 26, 2003·3 cites·11 claims
- 1953US5907166ASingle deposition layer metal dynamic random access memoryMICRON TECHNOLOGY INC·Filed 1997·Granted May 25, 1999·13 cites·18 claims
- 2051US6737734B2Structure and method for securing bussing leadsMICRON TECHNOLOGY INC·Filed 2003·Granted May 18, 2004·2 cites·14 claims
- 2151US2017270541A1System and Method for Monetizing Internet Traffic Related to a Property Value InquiryVICUNA LEADS LLC·Filed 2017·Application pending·0 cites
- 2250US7112252B2Assembly method for semiconductor die and lead frameMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 26, 2006·2 cites·26 claims
- 2350US2007000599A1Assembly method for semiconductor die and lead frameKINSMAN LARRY D·Filed 2006·Application pending·0 cites
- 2449US6274928B1Single deposition layer metal dynamic random access memoryMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 14, 2001·10 cites·46 claims
- 2548US6699734B2Method and apparatus for coupling a semiconductor die to die terminalsMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 2, 2004·2 cites·13 claims
- 2645US6349034B2Removable heat sink bumpers on a quad flat packageMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 19, 2002·1 cites·17 claims
- 2743US6409176B2Wellhead housing seal assembly with backup featureCOOPER CAMERON CORP·Filed 1998·Granted Jun 25, 2002·18 cites·31 claims
- 2842US5897340AHybrid frame with lead-lock tapeMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 27, 1999·5 cites·40 claims
- 2940US6579746B2Method and apparatus for coupling a semiconductor die to die terminalsMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 17, 2003·0 cites·15 claims
- 3038US2019340255A1Digital asset search techniquesAPPLE INC·Filed 2018·Application pending·0 cites
- 3135US6251708B1Hybrid frame with lead-lock tapeMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 26, 2001·2 cites·39 claims
- 3235US6008531AHybrid frame with lead-lock tapeMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 28, 1999·2 cites·73 claims
- 3334US2005057106A1Methods and systems for electric machines having windingsBALLARD POWER SYSTEMS·Filed 2003·Application pending·0 cites
- 3433US6146922AHybrid frame with lead-lock tapeMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 14, 2000·1 cites·40 claims
- 3533US2004217666A1Rotor assembly of synchronous machineBALLARD POWER SYSTEMS·Filed 2003·Application pending·0 cites
- 3631US6600215B1Method and apparatus for coupling a semiconductor die to die terminalsMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 29, 2003·1 cites·76 claims
- 3731US6388314B1Single deposition layer metal dynamic random access memoryMICRON TECHNOLOGY INC·Filed 1995·Granted May 14, 2002·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →