Inventor · disambiguated record
Tim Bales
Also filed as: BALES TIM · BALES TIM J
16 granted patents·110 citations·filing 1998–2014
93Inventor score
Files withMICRON TECHNOLOGY INC13EM MICROELECTRONIC MARIN SA1SEMICONDUCTOR COMPONENTS IND1SOLHUSVIK JOHANNES1
Top patents by PatentIndex Score
16 records- 0194US8890047B2Stacked-chip imaging systemsSOLHUSVIK JOHANNES·Filed 2012·Granted Nov 18, 2014·21 cites·18 claims
- 0281US9231011B2Stacked-chip imaging systemsSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted Jan 5, 2016·3 cites·20 claims
- 0381US6922341B2Semiconductor package assembly and method for electrically isolating modulesMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 26, 2005·17 cites·78 claims
- 0476US6137273ACircuit for supplying a high precision current to an external elementEM MICROELECTRONIC MARIN SA·Filed 1998·Granted Oct 24, 2000·39 cites·8 claims
- 0574US7579862B2MOS linear region impedance curvature correctionMICRON TECHNOLOGY INC·Filed 2007·Granted Aug 25, 2009·4 cites·14 claims
- 0669US7166918B2Semiconductor package assembly and method for electrically isolating modulesMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 23, 2007·2 cites·16 claims
- 0769US7091584B2Semiconductor package assembly and method for electrically isolating modulesMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 15, 2006·2 cites·20 claims
- 0868US6851183B2Semiconductor package assembly and method for electrically isolating modulesMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 8, 2005·8 cites·4 claims
- 0966US7403033B2MOS linear region impedance curvature correctionMICRON TECHNOLOGY INC·Filed 2007·Granted Jul 22, 2008·2 cites·18 claims
- 1064US7256068B2Semiconductor package assembly and method for electrically isolating modulesMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 14, 2007·1 cites·5 claims
- 1163US7282948B2MOS linear region impedance curvature correctionMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 16, 2007·6 cites·38 claims
- 1250US7432593B2Semiconductor package assembly and method for electrically isolating modulesMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 7, 2008·0 cites·16 claims
- 1350US7414299B2Semiconductor package assembly and method for electrically isolating modulesMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 19, 2008·0 cites·25 claims
- 1450US7176566B2Semiconductor package assembly and method for electrically isolating modulesMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 13, 2007·0 cites·12 claims
- 1550US6639424B2Combined dynamic logic gate and level shifter and method employing sameMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 28, 2003·5 cites·63 claims
- 1642US7221040B2Semiconductor package assembly and method for electrically isolating modulesMICRON TECHNOLOGY INC·Filed 2003·Granted May 22, 2007·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →