Inventor · disambiguated record
Tina Barcley
Also filed as: BARCLEY TINA · BARCLEY TINA P
12 granted patents·3 pending applications·397 citations·filing 1997–2002
93Inventor score
Top patents by PatentIndex Score
15 records- 0190US5917149AFlexible circuit board interconnect with strain reliefDAIMLER CHRYSLER CORP·Filed 1997·Granted Jun 29, 1999·88 cites·18 claims
- 0289US6678159B1Method of transporting heat from a heat dissipating electrical assemblageEASTMAN KODAK CO·Filed 2002·Granted Jan 13, 2004·47 cites·8 claims
- 0383US5981870AFlexible circuit board interconnect with strain reliefCHRYSLER CORP·Filed 1997·Granted Nov 9, 1999·59 cites·1 claims
- 0482US6477052B1Multiple layer thin flexible circuit boardDAIMLER CHRYSLER CORP·Filed 2000·Granted Nov 5, 2002·28 cites·17 claims
- 0581US6930885B2Densely packed electronic assemblage with heat removing elementEASTMAN KODAK CO·Filed 2002·Granted Aug 16, 2005·32 cites·23 claims
- 0681US6770967B2Remote thermal vias for densely packed electrical assemblageEASTMAN KODAK CO·Filed 2002·Granted Aug 3, 2004·33 cites·22 claims
- 0780US6882537B2Electrical assemblage and method for removing heat locally generated therefromEASTMAN KODAK CO·Filed 2002·Granted Apr 19, 2005·27 cites·20 claims
- 0876US6671176B1Method of cooling heat-generating electrical componentsEASTMAN KODAK CO·Filed 2002·Granted Dec 30, 2003·25 cites·7 claims
- 0975US6771504B2Thermal transport element for use with a heat dissipating electrical assemblageEASTMAN KODAK CO·Filed 2002·Granted Aug 3, 2004·20 cites·14 claims
- 1068US6820328B2Method of removing heat from an electronic assemblageEASTMAN KODAK CO·Filed 2002·Granted Nov 23, 2004·13 cites·15 claims
- 1156US7161240B2Insitu-cooled electrical assemblageEASTMAN KODAK CO·Filed 2002·Granted Jan 9, 2007·7 cites·19 claims
- 1254US5924873AFlexible circuit board interconnect with strain reliefCHRYSLER CORP·Filed 1997·Granted Jul 20, 1999·18 cites·8 claims
- 1338US2005284607A1Cooling-assisted, heat-generating electrical component and method of manufacturing sameEASTMAN KODAK CO·Filed 2002·Application pending·0 cites
- 1437US2003029637A1Circuit board assembly with ceramic capped components and heat transfer viasFiled 2001·Application pending·0 cites
- 1536US2003062196A1Anchor point for RF circuit boards and related methodsFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →