Inventor · disambiguated record
Timo Bohnenberger
Also filed as: BOHNENBERGER TIMO
1 granted patent·3 pending applications·0 citations·filing 2021–2024
6Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0154US2025157869A1Encapsulant with organic constituent and inorganic constituent having adjusted relative dielectric constantINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0251US2023369166A1Power semiconductor module arrangement and method for producing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 0350US2023420334A1Power semiconductor module arrangement and method for forming the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 0446US11626351B2Semiconductor package with barrier to contain thermal interface materialINFINEON TECHNOLOGIES AG·Filed 2021·Granted Apr 11, 2023·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →