Inventor · disambiguated record
Tim Böttcher
Also filed as: BÖTTCHER TIM
3 granted patents·15 pending applications·0 citations·filing 2019–2024
40Inventor score
Files withNexperia BV18
Top patents by PatentIndex Score
18 records- 0154US2025072063A1Semiconductor Device Having an Improved Termination Area Using a Plurality of Laterally Spaced Apart First Regions, as well as a Corresponding Method and Power Device.Nexperia BV·Filed 2024·Application pending·0 cites
- 0254US2025212469A1Semiconductor power device with termination ringsNexperia BV·Filed 2024·Application pending·0 cites
- 0353US2025107165A1Top surface of a junction termination extension for semiconductor devicesNexperia BV·Filed 2024·Application pending·0 cites
- 0453US2025107167A1Recessed regions of a junction termination extension for semiconductor devicesNexperia BV·Filed 2024·Application pending·0 cites
- 0552US2025212475A1Suppression of auto-doping during epitaxial growth of epitaxy layer in a semiconductor deviceNexperia BV·Filed 2024·Application pending·0 cites
- 0652US2024371712A1Method of improving package creepage distanceNexperia BV·Filed 2024·Application pending·0 cites
- 0751US11901407B2Semiconductor device with improved junction termination extension regionNexperia BV·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 0851US2024363768A1Schottky Barrier Control in Vertically Oriented Semiconductor Devices As Well As a Corresponding Power DeviceNexperia BV·Filed 2024·Application pending·0 cites
- 0951US2024363769A1Control of the Forward and Reverse Characteristics of Vertically Oriented Semiconductor DevicesNexperia BV·Filed 2024·Application pending·0 cites
- 1050US2023402550A1Transfer device for transferring an electronic componentNexperia BV·Filed 2023·Application pending·0 cites
- 1149US2024120260A1Semiconductor Package AssemblyNexperia BV·Filed 2023·Application pending·0 cites
- 1249US2024105447A1Method of Improving Package Creepage DistanceNexperia BV·Filed 2023·Application pending·0 cites
- 1349US2024072113A1Vertical semiconductor device and manufacturing method thereforNexperia BV·Filed 2023·Application pending·0 cites
- 1448US2024096933A1Semiconductor power device with improved ruggednessNexperia BV·Filed 2023·Application pending·0 cites
- 1546US2024120247A1Method of Manufacturing a Semiconductor Package, Such Semiconductor Package as well as an Electronic System Comprising a PCB Element and at Least Such Semiconductor PackageNexperia BV·Filed 2023·Application pending·0 cites
- 1645US2023307494A1Vertical oriented semiconductor device having a reduced lateral field termination distance, as well as a corresponding methodNexperia BV·Filed 2023·Application pending·0 cites
- 1743US11978780B2Semiconductor device and electrical contactNexperia BV·Filed 2019·Granted May 7, 2024·0 cites·15 claims
- 1842US11309409B2Pseudo Schottky diodeNexperia BV·Filed 2020·Granted Apr 19, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →