Inventor · disambiguated record
Ting-Kui Chang
Also filed as: CHANG TING-KUI
18 granted patents·4 pending applications·14 citations·filing 2013–2024
90Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD22
Top patents by PatentIndex Score
22 records- 0188US10269555B2Post-CMP cleaning and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·4 cites·20 claims
- 0286US10643892B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 5, 2020·3 cites·20 claims
- 0385US11211289B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·2 cites·20 claims
- 0484US9962805B2Chemical mechanical polishing apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 8, 2018·2 cites·20 claims
- 0583US12170195B2Post-CMP cleaning and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 0683US12068195B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 0778US11728157B2Post-CMP cleaning and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 0878US9576789B2Apparatus, method, and composition for far edge wafer cleaningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 21, 2017·3 cites·20 claims
- 0977US11710659B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 1076US12002684B2Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 1176US2024290629A1Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1274US2024379556A1Forming Liners to Facilitate The Formation of Copper-Containing Vias in Advanced Technology NodesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1372US12444646B2Devices with reduced capacitancesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 1472US11705324B2Apparatus and method for wafer cleaningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·0 cites·19 claims
- 1567US11508585B2Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 1667US2025289093A1System and method for real time inline mixing cmp slurryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1765US11322345B2Post-CMP cleaning and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 3, 2022·0 cites·20 claims
- 1863US10998184B2Apparatus and method for wafer cleaningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 4, 2021·0 cites·20 claims
- 1960US12046506B2Devices with reduced capacitancesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 23, 2024·0 cites·20 claims
- 2057US11658065B2Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 2157US2025038008A1Methods for chemical mechanical polishing and methods for forming an interconnect structure of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2256US10325772B2Apparatus and method for wafer cleaningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 18, 2019·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →