Inventor · disambiguated record
Ting-Hsun Chang
Also filed as: CHANG TING-HSUN
10 granted patents·5 pending applications·4 citations·filing 2013–2025
80Inventor score
Top patents by PatentIndex Score
15 records- 0186US11772228B2Chemical mechanical polishing apparatus including a multi-zone platenTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 3, 2023·2 cites·20 claims
- 0286US11679469B2Chemical mechanical planarization toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 20, 2023·2 cites·18 claims
- 0383US12172263B2Chemical mechanical planarization toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 0477US2025313723A1Composition and method for polishing and integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0576US12002684B2Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 0676US2024290629A1Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0773US2024379421A1Slurry composition, semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0869US2023364733A1Chemical Mechanical Polishing Apparatus Including a Multi-Zone PlatenTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0967US11508585B2Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 1066US12359090B2Composition and method for polishing and integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 15, 2025·0 cites·20 claims
- 1166US12131944B2Slurry composition, semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 29, 2024·0 cites·20 claims
- 1259US11121028B2Semiconductor devices formed using multiple planarization processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 14, 2021·0 cites·20 claims
- 1357US11658065B2Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 1453US10636701B2Methods of forming semiconductor devices using multiple planarization processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 28, 2020·0 cites·20 claims
- 1544US2014161550A1Micro-Drill and Method for Manufacturing the SameNAT UNIV TSING HUA·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →