Inventor · disambiguated record
Tin Poay Chuah
Also filed as: CHUAH TIN POAY
39 granted patents·15 pending applications·43 citations·filing 2013–2024
95Inventor score
Top patents by PatentIndex Score
54 records- 0194US11375617B2Three dimensional foldable substrate with vertical side interfaceINTEL CORP·Filed 2020·Granted Jun 28, 2022·3 cites·20 claims
- 0293US11355427B2Device, method and system for providing recessed interconnect structures of a substrateINTEL CORP·Filed 2016·Granted Jun 7, 2022·14 cites·19 claims
- 0385US9202782B2Embedded package in PCB build upCHUAH TIN POAY·Filed 2013·Granted Dec 1, 2015·9 cites·10 claims
- 0481US10856454B2Electromagnetic interference (EMI) shield for circuit card assembly (CCA)INTEL CORP·Filed 2019·Granted Dec 1, 2020·3 cites·20 claims
- 0581US10356902B2Board to board interconnectINTEL CORP·Filed 2015·Granted Jul 16, 2019·3 cites·10 claims
- 0680US10840177B2Interposer with flexible portionINTEL CORP·Filed 2019·Granted Nov 17, 2020·2 cites·20 claims
- 0779US11006514B2Three-dimensional decoupling integration within hole in motherboardINTEL CORP·Filed 2017·Granted May 11, 2021·3 cites·25 claims
- 0878US12061502B2Expandable thermal solution for laptopsINTEL CORP·Filed 2021·Granted Aug 13, 2024·1 cites·10 claims
- 0974US10701796B2Electromagnetic interference (EMI) shieldINTEL CORP·Filed 2018·Granted Jun 30, 2020·2 cites·19 claims
- 1073US11758662B2Three dimensional foldable substrate with vertical side interfaceINTEL CORP·Filed 2022·Granted Sep 12, 2023·0 cites·17 claims
- 1172US10772206B2Board to board interconnectINTEL CORP·Filed 2019·Granted Sep 8, 2020·1 cites·4 claims
- 1270US2023411385A1Package with embedded capacitorsINTEL CORP·Filed 2023·Application pending·0 cites
- 1370US2025125242A1Via plug resistorINTEL CORP·Filed 2024·Application pending·0 cites
- 1468US12349276B2Co-planar interconnection mechanisms for circuit boardsINTEL CORP·Filed 2022·Granted Jul 1, 2025·0 cites·22 claims
- 1568US10211069B2Embedded package in PCB build upINTEL CORP·Filed 2015·Granted Feb 19, 2019·1 cites·8 claims
- 1667US11942412B2Interposer with flexible portionINTEL CORP·Filed 2020·Granted Mar 26, 2024·0 cites·20 claims
- 1767US11304299B2Board to board interconnectINTEL CORP·Filed 2020·Granted Apr 12, 2022·0 cites·24 claims
- 1862US12328816B2Asymmetrical laminated circuit boards for improved electrical performanceINTEL CORP·Filed 2021·Granted Jun 10, 2025·0 cites·16 claims
- 1962US12250800B2Radiation shield with zipperINTEL CORP·Filed 2021·Granted Mar 11, 2025·0 cites·20 claims
- 2061US12218042B2Via plug resistorINTEL CORP·Filed 2021·Granted Feb 4, 2025·0 cites·22 claims
- 2161US11699664B2Wrappable EMI shieldsINTEL CORP·Filed 2020·Granted Jul 11, 2023·0 cites·15 claims
- 2261US11521943B2Method of forming a capacitive loop substrate assemblyINTEL CORP·Filed 2021·Granted Dec 6, 2022·0 cites·6 claims
- 2360US12256487B2Hybrid boards with embedded planesINTEL CORP·Filed 2021·Granted Mar 18, 2025·0 cites·20 claims
- 2459US11343906B2Stacked scalable voltage regulator module for platform area miniaturizationINTEL CORP·Filed 2020·Granted May 24, 2022·0 cites·15 claims
- 2557US12156331B2Technologies for power tunnels on circuit boardsINTEL CORP·Filed 2021·Granted Nov 26, 2024·0 cites·9 claims
- 2656US11556157B2Diagonal printed circuit boards systemsINTEL CORP·Filed 2020·Granted Jan 17, 2023·0 cites·15 claims
- 2756US10355384B2Integrated connector for electronic deviceINTEL CORP·Filed 2015·Granted Jul 16, 2019·1 cites·16 claims
- 2855US12309984B2Radiation shield and groove in support structureINTEL CORP·Filed 2021·Granted May 20, 2025·0 cites·19 claims
- 2954US11487326B2Elevated docking station for different mobile devicesINTEL CORP·Filed 2020·Granted Nov 1, 2022·0 cites·17 claims
- 3054US2024006786A1Composite printed circuit boards and devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 3154US2025113428A1Technologies for an electromagnetic interference shieldINTEL CORP·Filed 2023·Application pending·0 cites
- 3253US11172581B2Multi-planar circuit board having reduced z-heightINTEL CORP·Filed 2018·Granted Nov 9, 2021·0 cites·24 claims
- 3352US11589460B2System in package dual connectorINTEL CORP·Filed 2020·Granted Feb 21, 2023·0 cites·19 claims
- 3452US2025008685A1Fan modules for electronic devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 3552US2024006399A1Die-stacked and molded architecture for memory on package (mop)INTEL CORP·Filed 2022·Application pending·0 cites
- 3651US12424779B2Flexible printed circuit board arrangementINTEL CORP·Filed 2021·Granted Sep 23, 2025·0 cites·20 claims
- 3751US2023395480A1Substrate to board interconnect with liquid metal and surface pinsINTEL CORP·Filed 2022·Application pending·0 cites
- 3851US2024147654A1Laptop arrangement for heat controlINTEL CORP·Filed 2022·Application pending·0 cites
- 3951US2023397323A1Package bottom side thermal solution with discrete hat-shaped copper spreader componentINTEL CORP·Filed 2022·Application pending·0 cites
- 4050US12033953B2Electronic device and crosstalk mitigating substrateINTEL CORP·Filed 2020·Granted Jul 9, 2024·0 cites·22 claims
- 4150US11031359B2Capacitor loop structureINTEL CORP·Filed 2017·Granted Jun 8, 2021·0 cites·6 claims
- 4250US10939540B2Shielded folded circuit boardINTEL CORP·Filed 2019·Granted Mar 2, 2021·0 cites·24 claims
- 4350US2019006356A1Package with embedded capacitorsINTEL CORP·Filed 2018·Application pending·0 cites
- 4449US2022110214A1Stepped package and recessed circuit boardINTEL CORP·Filed 2021·Application pending·0 cites
- 4548US12406916B2Via plug capacitorINTEL CORP·Filed 2021·Granted Sep 2, 2025·0 cites·21 claims
- 4648US11445608B2Chassis interconnect for an electronic deviceINTEL CORP·Filed 2020·Granted Sep 13, 2022·0 cites·21 claims
- 4748US2023108868A1Methods and apparatus to increase rigidity of printed circuit boardsINTEL CORP·Filed 2022·Application pending·0 cites
- 4848US2024332127A1On-package embedded cooling deviceINTEL CORP·Filed 2023·Application pending·0 cites
- 4947US11696409B2Vertical embedded component in a printed circuit board blind holeINTEL CORP·Filed 2016·Granted Jul 4, 2023·0 cites·14 claims
- 5047US2021144844A1Metallic regions to shield a magnetic field sourceINTEL CORP·Filed 2021·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →