Inventor · disambiguated record
Ting Yu Fu
Also filed as: FU TING YU
2 granted patents·8 citations·filing 2011–2014
55Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0173US8741764B2Semiconductor device and method of forming conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrateCHEN JEN YU·Filed 2011·Granted Jun 3, 2014·5 cites·25 claims
- 0270US9478513B2Semiconductor device with conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrateSTATS CHIPPAC LTD·Filed 2014·Granted Oct 25, 2016·3 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →