Inventor · disambiguated record
Tingting Gao
Also filed as: GAO TINGTING
17 granted patents·26 pending applications·16 citations·filing 2013–2024
87Inventor score
Files withYANGTZE MEMORY TECH CO LTD29INTEL CORP7UNIV QILU TECHNOLOGY2ANDINO JEAN1Baidu online network technology beijing co ltd1
Top patents by PatentIndex Score
43 records- 0195US11563021B2Memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 24, 2023·10 cites·20 claims
- 0287US11716847B2Three-dimensional NAND memory device with split gatesYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Aug 1, 2023·2 cites·20 claims
- 0368US9545625B2Ionic liquid functionalized reduced graphite oxide / TiO2 nanocomposite for conversion of CO2 to CH4ANDINO JEAN·Filed 2013·Granted Jan 17, 2017·3 cites·18 claims
- 0468US2025331188A1Semiconductor device, manufacturing method, and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0565US12513905B2Three-dimensional memory device and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 0665US12507404B2Three-dimensional memories having isolation structures and fabrication methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
- 0764US12128687B2Method for controlling regenerated chip, regenerated chip and regenerated ink cartridgeHANGZHOU CHIPJET TECH CO LTD·Filed 2022·Granted Oct 29, 2024·0 cites·20 claims
- 0862US2025324595A1Semiconductor devices and fabrication methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0959US2025151289A1Semiconductor devices, three-dimensional memory devices, and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1058US2025357271A1Semiconductor package structure and manufacturing method thereof, and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1158US2025344412A1High bandwidth memory devices with multiple decksYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1256US12471279B2Channel structures for three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 1356US12234193B2Bismuth tungstate/bismuth sulfide/molybdenum disulfide heterojunction ternary composite material and preparation method and application thereofUNIV QILU TECHNOLOGY·Filed 2020·Granted Feb 25, 2025·0 cites·9 claims
- 1456US2025157906A1Fabricating semiconductor structures for semiconductor packagingYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1556US2023081001A1Hollow spherical cerium dioxide nanomaterial and preparation method and application thereofUNIV QILU TECHNOLOGY·Filed 2021·Application pending·0 cites
- 1655US2025253278A1Semiconductor devices, fabrication methods thereof, and memory systemsYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1755US2023415253A1Liquid metal (lm) dispensing apparatus and methods for design and operation of sameINTEL CORP·Filed 2022·Application pending·0 cites
- 1853US12052865B2Three-dimensional memory devices with channel structures having plum blossom shape and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jul 30, 2024·0 cites·19 claims
- 1953US12052866B2Two-step L-shaped selective epitaxial growthYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jul 30, 2024·0 cites·12 claims
- 2053US11917823B2Channel structures having protruding portions in three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Feb 27, 2024·0 cites·20 claims
- 2153US10072804B2Table lamp and a method of adjusting the direction of the light output from a table lampPHILIPS LIGHTING HOLDING BV·Filed 2015·Granted Sep 11, 2018·1 cites·14 claims
- 2253US2024379578A1Semiconductor structure, dicing method thereof, and memoryYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 2353US2025273545A1Semiconductor device and fabricating method thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 2453US2024130120A1Three-dimensional memory device, manufacturing method thereof, and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 2553US2024215237A1Three dimensional (3d) memory device and fabrication methodYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 2653US2024298353A1Random access method, and electronic device and storage mediumNEW H3C TECH CO LTD·Filed 2022·Application pending·0 cites
- 2753US2024130129A1Three-dimensional memory deivce, manufacturing method thereof, and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 2852US12089405B2Three-dimensional memory devices with channel structures having plum blossom shapeYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 10, 2024·0 cites·20 claims
- 2952US2025357236A1Bilayer encapsulation structure for liquid metal interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 3052US2025112190A1Self-diffusing liquid metal interconnect architectures enabling snap-on room temperature assemblyINTEL CORP·Filed 2023·Application pending·0 cites
- 3152US2024099008A1Three-dimensional memory device and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 3251US11925019B2Channel structures having protruding portions in three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Mar 5, 2024·0 cites·20 claims
- 3351US11751385B2Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 5, 2023·0 cites·20 claims
- 3448US12035524B2Channel structures having protruding portions in three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jul 9, 2024·0 cites·18 claims
- 3548US11877449B2Methods for forming three-dimensional memory devices with channel structures having plum blossom shapeYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 16, 2024·0 cites·20 claims
- 3648US2025006691A1Compliant inserts for pin dipping processesINTEL CORP·Filed 2023·Application pending·0 cites
- 3746US2024304506A1Integrated antioxidant and sealant solution to address temperature humidity reliability issue of liquid metal interconnectINTEL CORP·Filed 2023·Application pending·0 cites
- 3846US2022406795A1Three-dimensional memory device with divided drain select gate lines and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Application pending·0 cites
- 3945US2022123013A1Three-dimensional semiconductor device and method of fabrication thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Application pending·0 cites
- 4044US2023317476A1Direct injection filling device, system, and method for liquid metal interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 4143US2022123004A1Three-dimensional nand memory device with split channel gatesYANGTZE MEMORY TECH CO LTD·Filed 2020·Application pending·0 cites
- 4242US2024304473A1Methods and apparatus to place balls for second level interconnects of integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 4340US2015186662A1Method and apparatus for input verificationBaidu online network technology beijing co ltd·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →