Inventor · disambiguated record

Tiong C. Go

Also filed as: GO TIANG C · GO TIONG C

5 granted patents·1,472 citations·filing 1986–1991

88Inventor score

Technology areasH10W

Files withIRVINE SENSORS CORP5

Top patents by PatentIndex Score

5 records

0197US4983533AHigh-density electronic modules - process and productIRVINE SENSORS CORP·Filed 1987·Granted Jan 8, 1991·378 cites·11 claims
0297US4706166AHigh-density electronic modules--process and productIRVINE SENSORS CORP·Filed 1986·Granted Nov 10, 1987·337 cites·17 claims
0396US5104820AMethod of fabricating electronic circuitry unit containing stacked IC layers having lead reroutingIRVINE SENSORS CORP·Filed 1991·Granted Apr 14, 1992·410 cites·13 claims
0496US4764846AHigh density electronic package comprising stacked sub-modulesIRVINE SENSORS CORP·Filed 1987·Granted Aug 16, 1988·287 cites·18 claims
0580US4912545ABonding of aligned conductive bumps on adjacent surfacesIRVINE SENSORS CORP·Filed 1987·Granted Mar 27, 1990·60 cites·14 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →