Inventor · disambiguated record
Timothy V. Harper
Also filed as: HARPER TIMOTHY V
7 granted patents·2 pending applications·460 citations·filing 1995–2003
89Inventor score
Top patents by PatentIndex Score
9 records- 0196US6659512B1Integrated circuit package employing flip-chip technology and method of assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Dec 9, 2003·142 cites·11 claims
- 0292US6404648B1Assembly and method for constructing a multi-die integrated circuitHEWLETT PACKARD CO·Filed 2001·Granted Jun 11, 2002·94 cites·16 claims
- 0387US6469530B1Method and apparatus for testing of ball grid array circuitryAGILENT TECHNOLOGIES INC·Filed 2000·Granted Oct 22, 2002·44 cites·4 claims
- 0487US5633535ASpacing control in electronic device assembliesFiled 1995·Granted May 27, 1997·156 cites·9 claims
- 0577US7002254B2Integrated circuit package employing flip-chip technology and method of assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Feb 21, 2006·18 cites·10 claims
- 0648US6570271B2Apparatus for routing signalsHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted May 27, 2003·4 cites·14 claims
- 0743US6888227B2Apparatus for routing signalsHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted May 3, 2005·2 cites·10 claims
- 0840US2004036152A1Integrated circuit package employing flip-chip technology and method of assemblyFiled 2003·Application pending·0 cites
- 0934US2004012094A1Flip-chip integrated circuit package and method of assemblyFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →