Inventor · disambiguated record
Tim Hsiao
Also filed as: HSIAO TIM
0 granted patents·4 pending applications·0 citations·filing 2004–2015
Top patents by PatentIndex Score
4 records- 0149US2015279832A1Compound semiconductor integrated circuit with three-dimensionally formed componentsWIN SEMICONDUCTORS CORP·Filed 2015·Application pending·0 cites
- 0236US2010101640A1Optical structure and solar cell using the sameCHEN JAIN-CHENG·Filed 2009·Application pending·0 cites
- 0334US2006065571A1Wafer shipping box and wafer transportation methodHSIAO TIM·Filed 2004·Application pending·0 cites
- 0411US2013052817A1Method for the fabrication of bonding solder layers on metal bumps with improved coplanarityHSIAO TIM·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →