Inventor · disambiguated record
Tian Huang
Also filed as: HUANG TIAN · HUANG TIAN-SING
10 granted patents·3 pending applications·24 citations·filing 2013–2021
84Inventor score
Top patents by PatentIndex Score
13 records- 0190US11078112B2Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the sameCORNING INC·Filed 2018·Granted Aug 3, 2021·6 cites·20 claims
- 0289US10879182B2Assembly substrates including through hole vias and methods for making suchCORNING INC·Filed 2018·Granted Dec 29, 2020·8 cites·17 claims
- 0386US11152294B2Hermetic metallized via with improved reliabilityCORNING INC·Filed 2019·Granted Oct 19, 2021·4 cites·18 claims
- 0479US10077206B2Methods of etching glass substrates and glass substratesCORNING INC·Filed 2016·Granted Sep 18, 2018·4 cites·15 claims
- 0574US10580725B2Articles having vias with geometry attributes and methods for fabricating the sameCORNING INC·Filed 2018·Granted Mar 3, 2020·2 cites·20 claims
- 0665US11972993B2Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the sameCORNING INC·Filed 2021·Granted Apr 30, 2024·0 cites·20 claims
- 0759US11062986B2Articles having vias with geometry attributes and methods for fabricating the sameCORNING INC·Filed 2020·Granted Jul 13, 2021·0 cites·8 claims
- 0858US12292387B2Apparatus and method for inspecting laser defect inside of transparent materialCORNING INC·Filed 2021·Granted May 6, 2025·0 cites·20 claims
- 0954US11952310B2Silicate glass compositions useful for the efficient production of through glass viasCORNING INC·Filed 2020·Granted Apr 9, 2024·0 cites·19 claims
- 1050US2020354262A1High silicate glass articles possessing through glass vias and methods of making and using thereofCORNING INC·Filed 2020·Application pending·0 cites
- 1145US2022078920A1Glass substrates with blind vias having depth uniformity and methods for forming the sameCORNING INC·Filed 2021·Application pending·0 cites
- 1243US12180108B2Methods for etching vias in glass-based articles employing positive charge organic moleculesCORNING INC·Filed 2018·Granted Dec 31, 2024·0 cites·20 claims
- 1340US2014151264A1Wafer carrier and applications thereofHUANG TIAN-SING·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →