Inventor · disambiguated record
Tianhui Huang
Also filed as: HUANG TIANHUI
3 granted patents·5 pending applications·0 citations·filing 2015–2025
40Inventor score
Files withSHENGYI TECHNOLOGY CO LTD5XIAMEN INDUSTRIAL TECH RESEARCH INSTITUTE CO LTD2ZHUHAI PANTUM ELECTRONICS CO LTD1
Top patents by PatentIndex Score
8 records- 0153US9611377B2Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the sameSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Apr 4, 2017·0 cites·19 claims
- 0241US2024333852A1Image source determination method and apparatus thereof, electronic device, and storage mediumZHUHAI PANTUM ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0341US2018126701A1Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit boards using the sameSHENGYI TECHNOLOGY CO LTD·Filed 2016·Application pending·0 cites
- 0440US9752028B2Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit prepared from the sameSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Sep 5, 2017·0 cites·10 claims
- 0540US2025157535A1Method for operating memory apparatus, memory apparatus, device, and storage mediumXIAMEN INDUSTRIAL TECH RESEARCH INSTITUTE CO LTD·Filed 2025·Application pending·0 cites
- 0639US2025095701A1Memory read-write verification methodXIAMEN INDUSTRIAL TECH RESEARCH INSTITUTE CO LTD·Filed 2024·Application pending·0 cites
- 0738US10494502B2Halogen-free thermosetting resin composition, prepreg, laminate and printed circuit board comprising the sameSHENGYI TECHNOLOGY CO LTD·Filed 2016·Granted Dec 3, 2019·0 cites·20 claims
- 0832US2016185952A1Halogen-Free Thermosetting Resin Composition, Prepreg and Laminate for Printed Circuit Prepared From the SameSHENGYI TECHNOLOGY CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →