Inventor · disambiguated record
Tien-Hao Huang
Also filed as: HUANG TIEN-HAO
7 granted patents·4 pending applications·38 citations·filing 2009–2019
81Inventor score
Top patents by PatentIndex Score
11 records- 0191US8536672B2Image sensor package and fabrication method thereofCHANG SHU-MING·Filed 2011·Granted Sep 17, 2013·17 cites·21 claims
- 0286US8541877B2Electronic device package and method for fabricating the sameTSAI CHIA-LUN·Filed 2010·Granted Sep 24, 2013·9 cites·26 claims
- 0373US8866268B2Semiconductor package structure and manufacturing method thereofWU SHANG-YI·Filed 2011·Granted Oct 21, 2014·4 cites·20 claims
- 0467US8237187B2Package structure for chip and method for forming the sameHUANG TIEN-HAO·Filed 2009·Granted Aug 7, 2012·6 cites·20 claims
- 0562US9209371B2Semiconductor construction, semiconductor unit, and manufacturing method thereofUNISTARS·Filed 2013·Granted Dec 8, 2015·2 cites·10 claims
- 0648US2015226382A1Electroluminescent device and apparatus applying the sameUNISTARS CORP·Filed 2014·Application pending·0 cites
- 0744US9059384B2LED packaging construction and manufacturing method thereofUNISTARS·Filed 2013·Granted Jun 16, 2015·0 cites·15 claims
- 0841US2015060911A1Optoelectronic semiconductor device and fabricating method thereofUNISTARS CORP·Filed 2013·Application pending·0 cites
- 0940US8866313B2Substrate, semiconductor construction, and manufacturing method thereofUNISTARS CORP·Filed 2013·Granted Oct 21, 2014·0 cites·21 claims
- 1040US2021057622A1Light emitting device package structure and manufacturing method thereofUNISTARS CORP·Filed 2019·Application pending·0 cites
- 1136US2019348582A1Optoelectronic packageUNISTARS CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →