Inventor · disambiguated record

Tim J. Jondrow

Also filed as: JONDROW TIM J

2 granted patents·55 citations·filing 1997–1999

66Inventor score

Technology areasH10W

Files withHEWLETT PACKARD CO2

Top patents by PatentIndex Score

2 records

0164US5960535AHeat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sinkHEWLETT PACKARD CO·Filed 1997·Granted Oct 5, 1999·32 cites·11 claims
0256US6018193AHeat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sinkHEWLETT PACKARD CO·Filed 1999·Granted Jan 25, 2000·23 cites·5 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →