Inventor · disambiguated record
Tiang Siong Lian
Also filed as: LIAN TIANG S · LIAN TIANG SIONG
4 granted patents·77 citations·filing 1995–2003
78Inventor score
Top patents by PatentIndex Score
4 records- 0161US7245219B2RFID tag for an object having metallic portions, tag coupler and method thereofFCI SMARTAG PTE LTD·Filed 2003·Granted Jul 17, 2007·19 cites·38 claims
- 0260US5989471ABGA mould assembly for encapsulating BGA substrates of varying thicknessADVANCED SYSTEMS AUTOMATION LI·Filed 1997·Granted Nov 23, 1999·30 cites·9 claims
- 0355US5522713ADirect drive electro-mechanical press for encapsulating semiconductor devicesADVANCED SYSTEMS AUTOMATION PT·Filed 1995·Granted Jun 4, 1996·22 cites·7 claims
- 0434US5645776AMethod of encapsulating semiconductor devices by a direct drive electro-mechanical pressADVANCED SYSTEMS AUTOMATION PT·Filed 1996·Granted Jul 8, 1997·6 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →