Inventor · disambiguated record

Tien-Yu Liao

Also filed as: LIAO TIEN-YU

1 granted patent·1 pending application·0 citations·filing 2023–2024

7Inventor score

Technology areasG01R G06F

Files withWINBOND ELECTRONICS CORP2

Top patents by PatentIndex Score

2 records

0156US12007439B1Method and apparatus for integrated circuit testingWINBOND ELECTRONICS CORP·Filed 2023·Granted Jun 11, 2024·0 cites·18 claims
0245US2025335354A1Method for establishing memory cell group including different memory cellsWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →