Inventor · disambiguated record

Tiang Hock Lim

Also filed as: LIM TIANG HOCK

2 granted patents·79 citations·filing 1999–1999

67Inventor score

Technology areasH10W

Files withTEXAS INSTRUMENTS INC2

Top patents by PatentIndex Score

2 records

0168US6331737B1Method of encapsulating thin semiconductor chip-scale packagesTEXAS INSTRUMENTS INC·Filed 1999·Granted Dec 18, 2001·42 cites·17 claims
0265US6544816B1Method of encapsulating thin semiconductor chip-scale packagesTEXAS INSTRUMENTS INC·Filed 1999·Granted Apr 8, 2003·37 cites·16 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →