Inventor · disambiguated record

Tingyu Lin

Also filed as: LIN TINGYU

2 granted patents·25 citations·filing 2015–2017

60Inventor score

Technology areasH10W

Files withNAT CENTER FOR ADVANCED PACKAGING CO LTD2

Top patents by PatentIndex Score

2 records

0185US9653378B2Heat dissipation solution for advanced chip packagesNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2015·Granted May 16, 2017·19 cites·14 claims
0282US11067459B1Stress sensor structure and a manufacturing method thereofNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2017·Granted Jul 20, 2021·6 cites·10 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →