Inventor · disambiguated record
Tianjian Liu
Also filed as: LIU TIANJIAN
10 granted patents·8 pending applications·7 citations·filing 2019–2023
78Inventor score
Files withWUHAN XINXIN SEMICONDUCTOR MFG12UNIV MINJIANG2HUBEI 3D SEMICONDUCTOR INTEGRATED INNOVATION CENTER CO LTD1HUBEI YANGTZE PILOT LINE SERVICES CO LTD1UNIV SOUTHWEST PETROLEUM1
Top patents by PatentIndex Score
18 records- 0184US10943853B2Semiconductor device and manufacturing method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Mar 9, 2021·4 cites·20 claims
- 0277US11107794B2Multi-wafer stack structure and forming method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Aug 31, 2021·3 cites·7 claims
- 0353US12123996B2Method for experimentally determining critical sand-carrying gas velocity of shale gas wellsUNIV SOUTHWEST PETROLEUM·Filed 2023·Granted Oct 22, 2024·0 cites·1 claims
- 0452US12431364B2Method for manufacturing packaging enclosure and method for manufacturing packaging chipHUBEI YANGTZE PILOT LINE SERVICES CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·13 claims
- 0551US12178577B2Method and apparatus for fatigue prediction based on analogue brain wave dataUNIV MINJIANG·Filed 2021·Granted Dec 31, 2024·0 cites·8 claims
- 0647US12463165B2Bonding structure and manufacturing method thereforWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Granted Nov 4, 2025·0 cites·12 claims
- 0743US2024006454A1Backside illuminated image sensor substrate and method for manufacturing backside illuminated image sensorWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Application pending·0 cites
- 0843US2025316487A1Wafer cutting methodHUBEI 3D SEMICONDUCTOR INTEGRATED INNOVATION CENTER CO LTD·Filed 2022·Application pending·0 cites
- 0942US12421080B2Method and apparatus for non-contact and eye-movement input of elevator floorUNIV MINJIANG·Filed 2021·Granted Sep 23, 2025·0 cites·10 claims
- 1042US11043448B2Semiconductor device with vertically separated openings and manufacturing method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Jun 22, 2021·0 cites·11 claims
- 1141US11304680B2Spinal image generation system based on ultrasonic rubbing technique and navigation positioning system for spinal surgeryUNIV ZHEJIANG·Filed 2020·Granted Apr 19, 2022·0 cites·20 claims
- 1239US2024063174A1Chip bonding methodWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Application pending·0 cites
- 1339US2024047416A1Chip-to-wafer stacking methodWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Application pending·0 cites
- 1439US2023163102A1Bonding structure and manufacturing method thereforWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Application pending·0 cites
- 1539US2023377938A1Chip bonding methodWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Application pending·0 cites
- 1638US2024021559A1First chip and wafer bonding method and chip stacking structureWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Application pending·0 cites
- 1738US2023335504A1Wafer matching design method, wafer bonding structure and chip bonding structureWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Application pending·0 cites
- 1835US11164834B2Wafer structure and method for manufacturing the same, and chip structureWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Nov 2, 2021·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →