Inventor · disambiguated record
Ting Liu
Also filed as: LIU TING · LIU TING-PAN
5 granted patents·7 pending applications·1 citations·filing 2008–2024
61Inventor score
Files withLIU TING-PAN4COVESTRO DEUTSCHLAND AG3JCET GROUP CO LTD2FOSHAN YIXIN STONE CO LTD1STRATASYS INC1
Top patents by PatentIndex Score
12 records- 0172US2024380004A1Preparation method of flame-retardant ultrathin peo-based solid electrolyteUNIV NORTHWESTERN POLYTECHNICAL·Filed 2024·Application pending·0 cites
- 0268US11835103B2Deformable body and method for the production thereofCOVESTRO DEUTSCHLAND AG·Filed 2018·Granted Dec 5, 2023·1 cites·16 claims
- 0360US2024413059A1Package structure and method for forming sameJCET GROUP CO LTD·Filed 2024·Application pending·0 cites
- 0458US12454094B2Additive manufacturing process using a building material that contains metal-oxide coated micaSTRATASYS INC·Filed 2019·Granted Oct 28, 2025·0 cites·11 claims
- 0558US10906836B1Composite plate and preparation method thereofFOSHAN YIXIN STONE CO LTD·Filed 2019·Granted Feb 2, 2021·0 cites·10 claims
- 0657US11504906B2Method for producing products by means of additive manufacturing methods using reactive powders, and products thereofCOVESTRO DEUTSCHLAND AG·Filed 2018·Granted Nov 22, 2022·0 cites·11 claims
- 0747US11458671B2Additive manufacturing process using several thermoplastic polyurethanesCOVESTRO DEUTSCHLAND AG·Filed 2018·Granted Oct 4, 2022·0 cites·13 claims
- 0846US2023048687A1Qfn packaging structure and qfn packaging methodJCET GROUP CO LTD·Filed 2022·Application pending·0 cites
- 0944US2010089115A1Method of manufacturing uncommon form solder wiresLIU TING-PAN·Filed 2009·Application pending·0 cites
- 1043US2010122997A1Method of manufacturing irregular shapes of solder wires and product thereofLIU TING-PAN·Filed 2008·Application pending·0 cites
- 1131US2010120296A1Mechanism For Telecommunication ConnectorLIU TING-PAN·Filed 2009·Application pending·0 cites
- 1230US2010124854A1Structure for improving the voltage difference of a connectorLIU TING-PAN·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →