Inventor · disambiguated record
Tiburcio A. Maldo
Also filed as: MALDO TIBURCIO · MALDO TIBURCIO A
24 granted patents·3 pending applications·62 citations·filing 2006–2024
93Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC10FAIRCHILD SEMICONDUCTOR8LIU YONG5LITTELFUSE INC3SEMICONDUCTOR COMPONENTS IND1
Top patents by PatentIndex Score
27 records- 0189US7902646B2Multiphase synchronous buck converterFAIRCHILD SEMICONDUCTOR·Filed 2010·Granted Mar 8, 2011·11 cites·7 claims
- 0288US10566713B2Press-fit power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Feb 18, 2020·5 cites·18 claims
- 0383US8088645B23D smart power moduleLIU YONG·Filed 2010·Granted Jan 3, 2012·6 cites·10 claims
- 0480US8030743B2Semiconductor package with an embedded printed circuit board and stacked dieFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Oct 4, 2011·8 cites·11 claims
- 0580US7564124B2Semiconductor die package including stacked dice and heat sink structuresFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Jul 21, 2009·13 cites·28 claims
- 0678US8508025B2Folded leadframe multiple die packageLIU YONG·Filed 2012·Granted Aug 13, 2013·4 cites·17 claims
- 0777US12489080B2Flexible clip with aligner structureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Dec 2, 2025·0 cites·23 claims
- 0877US7808101B23D smart power moduleFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Oct 5, 2010·6 cites·17 claims
- 0976US10741480B2Leadframe with sockets for solderless pinsSEMICONDUCTOR COMPONENTS IND·Filed 2018·Granted Aug 11, 2020·2 cites·16 claims
- 1074US2024413148A1Isolated 3d semiconductor device package with transistors attached to opposing sides of leadframe sharing leadsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1168US8426953B2Semiconductor package with an embedded printed circuit board and stacked dieLIU YONG·Filed 2011·Granted Apr 23, 2013·2 cites·10 claims
- 1267US12119576B2Press-fit power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 15, 2024·0 cites·20 claims
- 1367US11222832B2Power semiconductor device packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jan 11, 2022·1 cites·21 claims
- 1466US12074160B2Isolated 3D semiconductor device package with transistors attached to opposing sides of leadframe sharing leadsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Aug 27, 2024·0 cites·20 claims
- 1566US11908826B2Flexible clip with aligner structureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 20, 2024·0 cites·22 claims
- 1666US10804626B2Press-fit power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 13, 2020·0 cites·20 claims
- 1766US7586179B2Wireless semiconductor package for efficient heat dissipationFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Sep 8, 2009·4 cites·13 claims
- 1864US11315856B2Leadframe with sockets for solderless pinsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Apr 26, 2022·0 cites·20 claims
- 1959US12500151B2Solderless and pressure contact connectionLITTELFUSE INC·Filed 2022·Granted Dec 16, 2025·0 cites·8 claims
- 2051US12456674B2Leadframeless electrically isolated power semiconductor packageLITTELFUSE INC·Filed 2023·Granted Oct 28, 2025·0 cites·16 claims
- 2151US8198710B2Folded leadframe multiple die packageLIU YONG·Filed 2008·Granted Jun 12, 2012·0 cites·27 claims
- 2250US12308338B2Power substrate assembly with reduced warpageLITTELFUSE INC·Filed 2022·Granted May 20, 2025·0 cites·11 claims
- 2350US7696612B2Multiphase synchronous buck converterFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Apr 13, 2010·0 cites·2 claims
- 2449US7952204B2Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the sameFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted May 31, 2011·0 cites·28 claims
- 2547US7821114B2Multiphase synchronous buck converterFAIRCHILD SEMICONDUCTOR·Filed 2009·Granted Oct 26, 2010·0 cites·13 claims
- 2645US2009194857A1Thin Compact Semiconductor Die Packages Suitable for Smart-Power Modules, Methods of Making the Same, and Systems Using the SameLIU YONG·Filed 2008·Application pending·0 cites
- 2741US2021159157A1Semiconductor clip and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →