Inventor · disambiguated record
Tim Mobley
Also filed as: MOBLEY TIM
10 granted patents·2 pending applications·122 citations·filing 2012–2021
88Inventor score
Top patents by PatentIndex Score
12 records- 0195US9374892B1Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic componentsTRITON MICROTECHNOLOGIES·Filed 2014·Granted Jun 21, 2016·32 cites·7 claims
- 0295US9236274B1Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic componentsTRITON MICROTECHNOLOGIES·Filed 2014·Granted Jan 12, 2016·33 cites·3 claims
- 0393US10292370B2Tracking and monitoring of animals with combined wireless technology and geo-fencingNMODE SOLUTIONS INC·Filed 2016·Granted May 21, 2019·13 cites·10 claims
- 0493US9337060B1Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic componentsTRITON MICROTECHNOLOGIES·Filed 2014·Granted May 10, 2016·18 cites·16 claims
- 0588US9184064B1System and method for metallization and reinforcement of glass substratesTRITON MICROTECHNOLOGIES·Filed 2014·Granted Nov 10, 2015·14 cites·20 claims
- 0685US9184135B1System and method for metallization and reinforcement of glass substratesTRITON MICROTECHNOLOGIES·Filed 2014·Granted Nov 10, 2015·10 cites·20 claims
- 0782US10798920B2Tracking and monitoring with geo-fencingNMODE SOLUTIONS INC·Filed 2018·Granted Oct 13, 2020·2 cites·19 claims
- 0866US2022059436A1Filling materials and methods of filling through holes of a substrateSAMTEC INC·Filed 2021·Application pending·0 cites
- 0956US11646246B2Method of fabricating a glass substrate with a plurality of viasSAMTEC INC·Filed 2017·Granted May 9, 2023·0 cites·19 claims
- 1056US11251109B2Filling materials and methods of filling through holes of a substrateSAMTEC INC·Filed 2017·Granted Feb 15, 2022·0 cites·22 claims
- 1156US2013340305A1Tracking and monitoring of animals with combined wireless technology and geofencingNMODE SOLUTIONS INC·Filed 2013·Application pending·0 cites
- 1244US9111917B2Low cost and high performance bonding of wafer to interposer and method of forming vias and circuitsTRITON MICROTECHNOLOGIES·Filed 2012·Granted Aug 18, 2015·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →