Inventor · disambiguated record
Tiam Sen Ong
Also filed as: ONG TIAM S · ONG TIAM SEN
4 granted patents·1 pending application·8 citations·filing 2007–2019
65Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0162US8116102B2Integrated circuit device and method of producingWONG CHEE PENG·Filed 2007·Granted Feb 14, 2012·7 cites·19 claims
- 0257US9659843B2Lead frame strip with molding compound channelsINFINEON TECHNOLOGIES AG·Filed 2014·Granted May 23, 2017·1 cites·9 claims
- 0353US10957633B2Semiconductor device packaging assembly, lead frame strip and unit lead frame with trenches or grooves for guiding liquefied molding materialINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 23, 2021·0 cites·6 claims
- 0447US10438870B2Semiconductor device packaging assembly, lead frame strip and unit lead frame with molding compound channelsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 8, 2019·0 cites·8 claims
- 0532US2008105960A1Integrated Circuit Package and Method for Manufacturing an Integrated Circuit PackageSEE BENG K·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →